Application of compound 8519-0065 in preparation of medicine for promoting skin wound healing

The invention discloses application of a compound 8519-0065 in preparation of a medicine for promoting skin wound healing, the molecular formula of the compound 8519-0065 is C26H25N5O2S, the structural formula of the compound 8519-0065 is # imgabs0 #, the compound 8519-0065 is used for preparing the...

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Hauptverfasser: HOU JIAKANG, LI QINGFENG, LIU YANGDAN, GAO YA, ZHANG YIFAN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses application of a compound 8519-0065 in preparation of a medicine for promoting skin wound healing, the molecular formula of the compound 8519-0065 is C26H25N5O2S, the structural formula of the compound 8519-0065 is # imgabs0 #, the compound 8519-0065 is used for preparing the medicine for promoting skin wound healing, and particularly, the compound 8519-0065 or pharmaceutically acceptable salt of the compound 8519-0065 serves as a small molecule medicine of an active ingredient. The skin wound healing promoting effect is achieved by promoting epidermal keratinocyte migration, the safety is high, the medicine is stable, the large-area skin wound can be treated, the synthesis cost is low, a new way is provided for clinically treating skin wound healing, and the skin wound healing promoting composition has important clinical application value. 本发明公开了化合物8519-0065在制备促进皮肤创面愈合的药物中的用途,其中化合物8519-0065的分子式为C26H25N5O2S,结构式为#imgabs0#本发明提出化合物8519-0065用于制备促进皮肤创面愈合的药物,特别是以化合物8519-0065或其药学上可接受的盐作为活性成分的