Silver alloy bonding wire and preparation method thereof

The invention discloses a silver alloy bonding wire and a preparation method thereof. The bonding wire comprises 1.1%-2.2% of palladium, 4.2%-9.6% of gold, 300-800 ppm of microelements and the balance silver. The preparation method comprises the following steps: S1, proportioning according to the ra...

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Bibliographische Detailangaben
Hauptverfasser:	PENG XIAOFEI, HUO JIANPING, WANG YOUREN, PENG SHUYAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASTING CASTING OF METALS CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PERFORMING OPERATIONS PHYSICS POWDER METALLURGY SEMICONDUCTOR DEVICES TESTING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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