Mn oxide synergistic 4H-SiC chemical mechanical polishing solution based on KMnO4-Al2O3 system
The invention relates to a Mn oxide synergistic 4H-SiC chemical mechanical polishing solution based on a KMnO4-Al2O3 system and a preparation method of the Mn oxide synergistic 4H-SiC chemical mechanical polishing solution. The polishing solution comprises an oxidizing agent KMnO4, Al2O3 abrasive pa...
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creator | LIU MIN XIAN WENHAO ZHANG BAOGUO CUI DEXING |
description | The invention relates to a Mn oxide synergistic 4H-SiC chemical mechanical polishing solution based on a KMnO4-Al2O3 system and a preparation method of the Mn oxide synergistic 4H-SiC chemical mechanical polishing solution. The polishing solution comprises an oxidizing agent KMnO4, Al2O3 abrasive particles, Mn oxide, a pH regulator and deionized water. Wherein the concentration of the oxidizing agent KMnO4 is 0.01 mol/L to 0.1 mol/L, the concentration of the Al2O3 abrasive particles is 0.01 wt.% to 10 wt.%, the particle size of the Al2O3 abrasive particles is 100 nm to 500 nm, the concentration of the Mn oxide is 0.01 wt.% to 1 wt.%, and the pH value of the 4H-SiC polishing solution is 7 to 11. And the Mn oxide is one or more of MnO2, Mn2O3 and Mn3O4. The invention further discloses a preparation method of the catalyst. The problems that a traditional silicon carbide polishing solution is low in 4H-SiC wafer surface material removal rate, poor in polished surface quality and serious in equipment corrosion are |
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The polishing solution comprises an oxidizing agent KMnO4, Al2O3 abrasive particles, Mn oxide, a pH regulator and deionized water. Wherein the concentration of the oxidizing agent KMnO4 is 0.01 mol/L to 0.1 mol/L, the concentration of the Al2O3 abrasive particles is 0.01 wt.% to 10 wt.%, the particle size of the Al2O3 abrasive particles is 100 nm to 500 nm, the concentration of the Mn oxide is 0.01 wt.% to 1 wt.%, and the pH value of the 4H-SiC polishing solution is 7 to 11. And the Mn oxide is one or more of MnO2, Mn2O3 and Mn3O4. The invention further discloses a preparation method of the catalyst. 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The polishing solution comprises an oxidizing agent KMnO4, Al2O3 abrasive particles, Mn oxide, a pH regulator and deionized water. Wherein the concentration of the oxidizing agent KMnO4 is 0.01 mol/L to 0.1 mol/L, the concentration of the Al2O3 abrasive particles is 0.01 wt.% to 10 wt.%, the particle size of the Al2O3 abrasive particles is 100 nm to 500 nm, the concentration of the Mn oxide is 0.01 wt.% to 1 wt.%, and the pH value of the 4H-SiC polishing solution is 7 to 11. And the Mn oxide is one or more of MnO2, Mn2O3 and Mn3O4. The invention further discloses a preparation method of the catalyst. 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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES TRANSPORTING |
title | Mn oxide synergistic 4H-SiC chemical mechanical polishing solution based on KMnO4-Al2O3 system |
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