Temperature-adjustable curing device for epoxy resin processing
The invention discloses a temperature-adjustable curing device for epoxy resin processing. The temperature-adjustable curing device comprises a heat insulation box; the device further comprises a plurality of net plates, the net plates are fixedly arranged in the heat insulation box at equal interva...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | LIU XIAOHONG GAO SHUYING LEI XIAOSHENG GAO YUANSHENG |
| description | The invention discloses a temperature-adjustable curing device for epoxy resin processing. The temperature-adjustable curing device comprises a heat insulation box; the device further comprises a plurality of net plates, the net plates are fixedly arranged in the heat insulation box at equal intervals, a plurality of molds are arranged on the net plates, demolding mechanisms are arranged in the molds, and the demolding mechanisms conduct demolding treatment on cured epoxy resin. And the heating mechanism is arranged on the side wall of the heat insulation box. The improved curing device for epoxy resin processing is stable in epoxy resin heating intensity and high in epoxy resin heating speed, the situation that the temperature of part of the mold position is too high is avoided, and after the epoxy resin is scratched, demolding treatment between most positions of the cured epoxy resin and the inner wall of the mold can be automatically completed; after epoxy resin curing operation is completed, the temperatu |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117415986A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117415986A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117415986A3</originalsourceid><addsrcrecordid>eNrjZLAPSc0tSC1KLCktStVNTMkqLS5JTMpJVUguLcrMS1dISS3LTE5VSMsvUkgtyK-oVChKLc7MUygoyk9OLQay0nkYWNMSc4pTeaE0N4Oim2uIs4cuUHl8anFBYnJqXmpJvLOfoaG5iaGppYWZozExagDj2jGm</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Temperature-adjustable curing device for epoxy resin processing</title><source>esp@cenet</source><creator>LIU XIAOHONG ; GAO SHUYING ; LEI XIAOSHENG ; GAO YUANSHENG</creator><creatorcontrib>LIU XIAOHONG ; GAO SHUYING ; LEI XIAOSHENG ; GAO YUANSHENG</creatorcontrib><description>The invention discloses a temperature-adjustable curing device for epoxy resin processing. The temperature-adjustable curing device comprises a heat insulation box; the device further comprises a plurality of net plates, the net plates are fixedly arranged in the heat insulation box at equal intervals, a plurality of molds are arranged on the net plates, demolding mechanisms are arranged in the molds, and the demolding mechanisms conduct demolding treatment on cured epoxy resin. And the heating mechanism is arranged on the side wall of the heat insulation box. The improved curing device for epoxy resin processing is stable in epoxy resin heating intensity and high in epoxy resin heating speed, the situation that the temperature of part of the mold position is too high is avoided, and after the epoxy resin is scratched, demolding treatment between most positions of the cured epoxy resin and the inner wall of the mold can be automatically completed; after epoxy resin curing operation is completed, the temperatu</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240119&DB=EPODOC&CC=CN&NR=117415986A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240119&DB=EPODOC&CC=CN&NR=117415986A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LIU XIAOHONG</creatorcontrib><creatorcontrib>GAO SHUYING</creatorcontrib><creatorcontrib>LEI XIAOSHENG</creatorcontrib><creatorcontrib>GAO YUANSHENG</creatorcontrib><title>Temperature-adjustable curing device for epoxy resin processing</title><description>The invention discloses a temperature-adjustable curing device for epoxy resin processing. The temperature-adjustable curing device comprises a heat insulation box; the device further comprises a plurality of net plates, the net plates are fixedly arranged in the heat insulation box at equal intervals, a plurality of molds are arranged on the net plates, demolding mechanisms are arranged in the molds, and the demolding mechanisms conduct demolding treatment on cured epoxy resin. And the heating mechanism is arranged on the side wall of the heat insulation box. The improved curing device for epoxy resin processing is stable in epoxy resin heating intensity and high in epoxy resin heating speed, the situation that the temperature of part of the mold position is too high is avoided, and after the epoxy resin is scratched, demolding treatment between most positions of the cured epoxy resin and the inner wall of the mold can be automatically completed; after epoxy resin curing operation is completed, the temperatu</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPSc0tSC1KLCktStVNTMkqLS5JTMpJVUguLcrMS1dISS3LTE5VSMsvUkgtyK-oVChKLc7MUygoyk9OLQay0nkYWNMSc4pTeaE0N4Oim2uIs4cuUHl8anFBYnJqXmpJvLOfoaG5iaGppYWZozExagDj2jGm</recordid><startdate>20240119</startdate><enddate>20240119</enddate><creator>LIU XIAOHONG</creator><creator>GAO SHUYING</creator><creator>LEI XIAOSHENG</creator><creator>GAO YUANSHENG</creator><scope>EVB</scope></search><sort><creationdate>20240119</creationdate><title>Temperature-adjustable curing device for epoxy resin processing</title><author>LIU XIAOHONG ; GAO SHUYING ; LEI XIAOSHENG ; GAO YUANSHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117415986A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>LIU XIAOHONG</creatorcontrib><creatorcontrib>GAO SHUYING</creatorcontrib><creatorcontrib>LEI XIAOSHENG</creatorcontrib><creatorcontrib>GAO YUANSHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LIU XIAOHONG</au><au>GAO SHUYING</au><au>LEI XIAOSHENG</au><au>GAO YUANSHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Temperature-adjustable curing device for epoxy resin processing</title><date>2024-01-19</date><risdate>2024</risdate><abstract>The invention discloses a temperature-adjustable curing device for epoxy resin processing. The temperature-adjustable curing device comprises a heat insulation box; the device further comprises a plurality of net plates, the net plates are fixedly arranged in the heat insulation box at equal intervals, a plurality of molds are arranged on the net plates, demolding mechanisms are arranged in the molds, and the demolding mechanisms conduct demolding treatment on cured epoxy resin. And the heating mechanism is arranged on the side wall of the heat insulation box. The improved curing device for epoxy resin processing is stable in epoxy resin heating intensity and high in epoxy resin heating speed, the situation that the temperature of part of the mold position is too high is avoided, and after the epoxy resin is scratched, demolding treatment between most positions of the cured epoxy resin and the inner wall of the mold can be automatically completed; after epoxy resin curing operation is completed, the temperatu</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117415986A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Temperature-adjustable curing device for epoxy resin processing |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T13%3A29%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LIU%20XIAOHONG&rft.date=2024-01-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117415986A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |