Low-K wafer cutting protection liquid, preparation method, application and cutting protection method

The invention provides a water-based cutting protection liquid for a Low-K wafer, a preparation method, an application, a Low-K wafer cutting protection method using the protection liquid and the like, the protection liquid comprises a water-soluble polymer, a wetting agent, a solubilizer, a defoaming agent and ultrapure water, and a mixture of PEO/PEG with low molecular weight and PVP with low molecular weight is adopted, so that the low-molecular-weight PEO/PEG and PVP with low molecular weight are mixed, and the low-molecular-weight PEO/PEG and PVP with low molecular weight are added into the water-based cutting protection liquid for the Low-K wafer. And compact net-shaped molecule arrangement can be formed, so that a compact film layer can be formed on the wafer, and heat and slag generated in the laser cutting process of the Low-K wafer are blocked. And meanwhile, silicon chips generated by cutting can be wrapped in the subsequent cutting process of the cutter wheel, and the effects of suspending and dis