Closed-loop temperature control system and temperature control method
The invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system. The closed-loop temperature control system comprises a main heating plate, a temperature compensation part, a main control unit, a power adjusting unit,...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SUN YUANBIN HAN YU JIANG YUNHE CHEN XINGLONG |
| description | The invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system. The closed-loop temperature control system comprises a main heating plate, a temperature compensation part, a main control unit, a power adjusting unit, a power feedback unit and a temperature feedback unit. The main control unit, the power regulation unit and the temperature compensation part are electrically connected in sequence, the power feedback unit is electrically connected with the power regulation unit in parallel, and the temperature feedback unit is electrically connected with the main control unit and the temperature compensation part, so that double closed-loop control of power and temperature can be realized; the temperature uniformity of the semiconductor substrate can be effectively controlled with as low manufacturing and maintenance costs as possible.
本发明提供了一种闭环温度控制系统和应用所述闭环温度控制系统进行的温度控制方法。所述闭环温度控制系统包括主加热板、温度补偿部、主控制单元、功率调节单元、功率反馈单元和温度反馈单元。所述主控制单元 |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117369561A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117369561A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117369561A3</originalsourceid><addsrcrecordid>eNrjZHB1zskvTk3RzcnPL1AoSc0tSC1KLCktSlVIzs8rKcrPUSiuLAYKKyTmpWCVzk0tychP4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hobmxmaWpmaGjsbEqAEAVyk0Eg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Closed-loop temperature control system and temperature control method</title><source>esp@cenet</source><creator>SUN YUANBIN ; HAN YU ; JIANG YUNHE ; CHEN XINGLONG</creator><creatorcontrib>SUN YUANBIN ; HAN YU ; JIANG YUNHE ; CHEN XINGLONG</creatorcontrib><description>The invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system. The closed-loop temperature control system comprises a main heating plate, a temperature compensation part, a main control unit, a power adjusting unit, a power feedback unit and a temperature feedback unit. The main control unit, the power regulation unit and the temperature compensation part are electrically connected in sequence, the power feedback unit is electrically connected with the power regulation unit in parallel, and the temperature feedback unit is electrically connected with the main control unit and the temperature compensation part, so that double closed-loop control of power and temperature can be realized; the temperature uniformity of the semiconductor substrate can be effectively controlled with as low manufacturing and maintenance costs as possible.
本发明提供了一种闭环温度控制系统和应用所述闭环温度控制系统进行的温度控制方法。所述闭环温度控制系统包括主加热板、温度补偿部、主控制单元、功率调节单元、功率反馈单元和温度反馈单元。所述主控制单元</description><language>chi ; eng</language><subject>CONTROLLING ; PHYSICS ; REGULATING ; SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240109&DB=EPODOC&CC=CN&NR=117369561A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240109&DB=EPODOC&CC=CN&NR=117369561A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN YUANBIN</creatorcontrib><creatorcontrib>HAN YU</creatorcontrib><creatorcontrib>JIANG YUNHE</creatorcontrib><creatorcontrib>CHEN XINGLONG</creatorcontrib><title>Closed-loop temperature control system and temperature control method</title><description>The invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system. The closed-loop temperature control system comprises a main heating plate, a temperature compensation part, a main control unit, a power adjusting unit, a power feedback unit and a temperature feedback unit. The main control unit, the power regulation unit and the temperature compensation part are electrically connected in sequence, the power feedback unit is electrically connected with the power regulation unit in parallel, and the temperature feedback unit is electrically connected with the main control unit and the temperature compensation part, so that double closed-loop control of power and temperature can be realized; the temperature uniformity of the semiconductor substrate can be effectively controlled with as low manufacturing and maintenance costs as possible.
本发明提供了一种闭环温度控制系统和应用所述闭环温度控制系统进行的温度控制方法。所述闭环温度控制系统包括主加热板、温度补偿部、主控制单元、功率调节单元、功率反馈单元和温度反馈单元。所述主控制单元</description><subject>CONTROLLING</subject><subject>PHYSICS</subject><subject>REGULATING</subject><subject>SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1zskvTk3RzcnPL1AoSc0tSC1KLCktSlVIzs8rKcrPUSiuLAYKKyTmpWCVzk0tychP4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hobmxmaWpmaGjsbEqAEAVyk0Eg</recordid><startdate>20240109</startdate><enddate>20240109</enddate><creator>SUN YUANBIN</creator><creator>HAN YU</creator><creator>JIANG YUNHE</creator><creator>CHEN XINGLONG</creator><scope>EVB</scope></search><sort><creationdate>20240109</creationdate><title>Closed-loop temperature control system and temperature control method</title><author>SUN YUANBIN ; HAN YU ; JIANG YUNHE ; CHEN XINGLONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117369561A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CONTROLLING</topic><topic>PHYSICS</topic><topic>REGULATING</topic><topic>SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUN YUANBIN</creatorcontrib><creatorcontrib>HAN YU</creatorcontrib><creatorcontrib>JIANG YUNHE</creatorcontrib><creatorcontrib>CHEN XINGLONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUN YUANBIN</au><au>HAN YU</au><au>JIANG YUNHE</au><au>CHEN XINGLONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Closed-loop temperature control system and temperature control method</title><date>2024-01-09</date><risdate>2024</risdate><abstract>The invention provides a closed-loop temperature control system and a temperature control method using the closed-loop temperature control system. The closed-loop temperature control system comprises a main heating plate, a temperature compensation part, a main control unit, a power adjusting unit, a power feedback unit and a temperature feedback unit. The main control unit, the power regulation unit and the temperature compensation part are electrically connected in sequence, the power feedback unit is electrically connected with the power regulation unit in parallel, and the temperature feedback unit is electrically connected with the main control unit and the temperature compensation part, so that double closed-loop control of power and temperature can be realized; the temperature uniformity of the semiconductor substrate can be effectively controlled with as low manufacturing and maintenance costs as possible.
本发明提供了一种闭环温度控制系统和应用所述闭环温度控制系统进行的温度控制方法。所述闭环温度控制系统包括主加热板、温度补偿部、主控制单元、功率调节单元、功率反馈单元和温度反馈单元。所述主控制单元</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN117369561A |
| source | esp@cenet |
| subjects | CONTROLLING PHYSICS REGULATING SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES |
| title | Closed-loop temperature control system and temperature control method |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T01%3A24%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SUN%20YUANBIN&rft.date=2024-01-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117369561A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |