Semiconductor package for camera module
A semiconductor package, which is a wafer-level chip-scale package type semiconductor package having a plurality of terminals, the semiconductor package having a planar appearance of an elongated rectangular shape, the plurality of terminals being configured in two rows arranged along the short-side...
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| creator | KIM DONG-WON HYUN KYOUNG-WON |
| description | A semiconductor package, which is a wafer-level chip-scale package type semiconductor package having a plurality of terminals, the semiconductor package having a planar appearance of an elongated rectangular shape, the plurality of terminals being configured in two rows arranged along the short-side direction of the semiconductor package, each of the terminals includes a circular main body portion and a protruding portion having a shape protruding outward from the main body portion.
一种半导体封装件，作为具有多个端子的晶片级芯片尺寸封装型的半导体封装件，其中，所述半导体封装件具有狭长的矩形形状的平面外观，所述多个端子由沿着所述半导体封装件的短边方向配置的2列构成，各个所述端子包括圆形的主体部和从所述主体部向外侧伸出的形状的凸出部。 |
| format | Patent |
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一种半导体封装件，作为具有多个端子的晶片级芯片尺寸封装型的半导体封装件，其中，所述半导体封装件具有狭长的矩形形状的平面外观，所述多个端子由沿着所述半导体封装件的短边方向配置的2列构成，各个所述端子包括圆形的主体部和从所述主体部向外侧伸出的形状的凸出部。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PICTORIAL COMMUNICATION, e.g. TELEVISION ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231226&DB=EPODOC&CC=CN&NR=117296146A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231226&DB=EPODOC&CC=CN&NR=117296146A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM DONG-WON</creatorcontrib><creatorcontrib>HYUN KYOUNG-WON</creatorcontrib><title>Semiconductor package for camera module</title><description>A semiconductor package, which is a wafer-level chip-scale package type semiconductor package having a plurality of terminals, the semiconductor package having a planar appearance of an elongated rectangular shape, the plurality of terminals being configured in two rows arranged along the short-side direction of the semiconductor package, each of the terminals includes a circular main body portion and a protruding portion having a shape protruding outward from the main body portion.
一种半导体封装件，作为具有多个端子的晶片级芯片尺寸封装型的半导体封装件，其中，所述半导体封装件具有狭长的矩形形状的平面外观，所述多个端子由沿着所述半导体封装件的短边方向配置的2列构成，各个所述端子包括圆形的主体部和从所述主体部向外侧伸出的形状的凸出部。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PICTORIAL COMMUNICATION, e.g. TELEVISION</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAPTs3NTM7PSylNLskvUihITM5OTE9VSAOykxNzU4sSFXLzU0pzUnkYWNMSc4pTeaE0N4Oim2uIs4duakF-fGoxUF9qXmpJvLOfoaG5kaWZoYmZozExagCmvif5</recordid><startdate>20231226</startdate><enddate>20231226</enddate><creator>KIM DONG-WON</creator><creator>HYUN KYOUNG-WON</creator><scope>EVB</scope></search><sort><creationdate>20231226</creationdate><title>Semiconductor package for camera module</title><author>KIM DONG-WON ; HYUN KYOUNG-WON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117296146A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PICTORIAL COMMUNICATION, e.g. TELEVISION</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM DONG-WON</creatorcontrib><creatorcontrib>HYUN KYOUNG-WON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM DONG-WON</au><au>HYUN KYOUNG-WON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Semiconductor package for camera module</title><date>2023-12-26</date><risdate>2023</risdate><abstract>A semiconductor package, which is a wafer-level chip-scale package type semiconductor package having a plurality of terminals, the semiconductor package having a planar appearance of an elongated rectangular shape, the plurality of terminals being configured in two rows arranged along the short-side direction of the semiconductor package, each of the terminals includes a circular main body portion and a protruding portion having a shape protruding outward from the main body portion.
一种半导体封装件，作为具有多个端子的晶片级芯片尺寸封装型的半导体封装件，其中，所述半导体封装件具有狭长的矩形形状的平面外观，所述多个端子由沿着所述半导体封装件的短边方向配置的2列构成，各个所述端子包括圆形的主体部和从所述主体部向外侧伸出的形状的凸出部。</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES |
| title | Semiconductor package for camera module |
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