High-speed light emitting assembly and corresponding optical module

High-speed light emitting assembly and corresponding optical module

The invention relates to the technical field of optical modules, and provides a high-speed light emitting assembly and a corresponding optical module.The high-speed light emitting assembly comprises a substrate, a protection plate and a laser chip; the laser chip is arranged on the substrate, the su...

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Hauptverfasser: WANG SHEN, GAO WANCHAO, LI XIAOLEI, DENG KUN, ZHAO ERJING, SUN LIPING
Format: Patent
Sprache:chi ; eng
Schlagworte:
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
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creator WANG SHEN
GAO WANCHAO
LI XIAOLEI
DENG KUN
ZHAO ERJING
SUN LIPING
description The invention relates to the technical field of optical modules, and provides a high-speed light emitting assembly and a corresponding optical module.The high-speed light emitting assembly comprises a substrate, a protection plate and a laser chip; the laser chip is arranged on the substrate, the substrate is also provided with a signal transmission line, one end of the signal transmission line is connected with the laser chip, and the other end of the signal transmission line is used for being connected with a metal bonding pad on a PCB (Printed Circuit Board) to form a transmission channel of a high-speed signal; and the protection plate is arranged above the signal transmission line and is used for forming a complete shielding plane together with the substrate so as to shield energy radiation when the high-speed signal is transmitted in the signal transmission line. Magnetic field lines are completely bound between the upper reference ground plane and the lower reference ground plane, so that energy radiat
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subjects ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
TRANSMISSION
title High-speed light emitting assembly and corresponding optical module
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