Adhesive tape damage detection method and system based on support vector machine

The invention relates to an adhesive tape damage detection method based on a support vector machine, which comprises the following steps of: S1, acquiring photoelectric data of a sample containing a damage mark, and preprocessing the photoelectric data; s2, wavelet transform is adopted to obtain the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN KEBO, LIN KEHUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING
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