Circuit board with crimping structure and manufacturing method of crimping structure
The invention discloses a circuit board with a crimping structure and a manufacturing method of the crimping structure, the circuit board comprises a circuit board body, the circuit board body comprises a first circuit board layer and a second circuit board layer, the bottom of the first circuit boa...
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| creator | LU HAIHANG CHEN WENDE XU QIAODAN KE MUZHEN LIU TAO |
| description | The invention discloses a circuit board with a crimping structure and a manufacturing method of the crimping structure, the circuit board comprises a circuit board body, the circuit board body comprises a first circuit board layer and a second circuit board layer, the bottom of the first circuit board layer is fixedly provided with a plurality of crimping top members, and the two sides of the bottom of each crimping top member are bonded with rubber pads. Elastic outer frames are integrally formed on the two sides of the exterior of the rubber mat, inserting grooves are formed in the two sides of the bottom of the crimping top piece, layer inserting grooves are formed in the bottom of the crimping top piece, a plurality of crimping bottom pieces are fixedly installed in the second circuit board layer, layer inserting pieces are integrally formed on the exteriors of the crimping bottom pieces, and a conductive piece is welded to one side of the top of the first circuit board layer. After the crimping top piece |
| format | Patent |
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Elastic outer frames are integrally formed on the two sides of the exterior of the rubber mat, inserting grooves are formed in the two sides of the bottom of the crimping top piece, layer inserting grooves are formed in the bottom of the crimping top piece, a plurality of crimping bottom pieces are fixedly installed in the second circuit board layer, layer inserting pieces are integrally formed on the exteriors of the crimping bottom pieces, and a conductive piece is welded to one side of the top of the first circuit board layer. After the crimping top piece</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231208&DB=EPODOC&CC=CN&NR=117202497A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231208&DB=EPODOC&CC=CN&NR=117202497A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LU HAIHANG</creatorcontrib><creatorcontrib>CHEN WENDE</creatorcontrib><creatorcontrib>XU QIAODAN</creatorcontrib><creatorcontrib>KE MUZHEN</creatorcontrib><creatorcontrib>LIU TAO</creatorcontrib><title>Circuit board with crimping structure and manufacturing method of crimping structure</title><description>The invention discloses a circuit board with a crimping structure and a manufacturing method of the crimping structure, the circuit board comprises a circuit board body, the circuit board body comprises a first circuit board layer and a second circuit board layer, the bottom of the first circuit board layer is fixedly provided with a plurality of crimping top members, and the two sides of the bottom of each crimping top member are bonded with rubber pads. Elastic outer frames are integrally formed on the two sides of the exterior of the rubber mat, inserting grooves are formed in the two sides of the bottom of the crimping top piece, layer inserting grooves are formed in the bottom of the crimping top piece, a plurality of crimping bottom pieces are fixedly installed in the second circuit board layer, layer inserting pieces are integrally formed on the exteriors of the crimping bottom pieces, and a conductive piece is welded to one side of the top of the first circuit board layer. 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Elastic outer frames are integrally formed on the two sides of the exterior of the rubber mat, inserting grooves are formed in the two sides of the bottom of the crimping top piece, layer inserting grooves are formed in the bottom of the crimping top piece, a plurality of crimping bottom pieces are fixedly installed in the second circuit board layer, layer inserting pieces are integrally formed on the exteriors of the crimping bottom pieces, and a conductive piece is welded to one side of the top of the first circuit board layer. After the crimping top piece</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Circuit board with crimping structure and manufacturing method of crimping structure |
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