Chip transfer device

Chip transfer device

According to the chip transfer device, the second carrier plate moving device is provided with the clamping and adsorbing device and the clamping device, when the second carrier plate is grabbed, the second carrier plate is adsorbed through the clamping and adsorbing device, the second carrier plate...

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Hauptverfasser: GUAN HONGMING, LO GUO-QIANG, ZHENG CANSHENG, WANG YONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator GUAN HONGMING
LO GUO-QIANG
ZHENG CANSHENG
WANG YONG
description According to the chip transfer device, the second carrier plate moving device is provided with the clamping and adsorbing device and the clamping device, when the second carrier plate is grabbed, the second carrier plate is adsorbed through the clamping and adsorbing device, the second carrier plate is clamped through the clamping device, and the reliability is good; both the bearing device and the transfer platform can move longitudinally and transversely, when the LED chips are transferred, the LED chips transversely arranged on the first elastic adhesive layer can be transferred to the second adhesive layer, and the LED chips longitudinally arranged on the first elastic adhesive layer can also be transferred to the second adhesive layer, so that when the LED chips are transferred each time, the LED chips are transferred to the second adhesive layer. And the LED chips can be fully distributed on the second adhesive layer, so that the working efficiency is high. 本发明提供一种芯片转移装置，第二载板搬移装置设置夹取吸附装置和夹取装置，在抓取载板二时，通过
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Chip transfer device
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