BGA (ball grid array) ball mounting high-definition image acquisition device and image processing method

The method is suitable for the technical field of BGA ball mounting packaging. The invention discloses a BGA (ball grid array) ball mounting high-definition image acquisition device and an image processing method. The BGA ball mounting high-definition image processing method comprises a preprocessin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XIAO WENHUI, DAI YIYI, CHEN YUJIE, TOSHIYASU KEN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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