BGA (ball grid array) ball mounting high-definition image acquisition device and image processing method
The method is suitable for the technical field of BGA ball mounting packaging. The invention discloses a BGA (ball grid array) ball mounting high-definition image acquisition device and an image processing method. The BGA ball mounting high-definition image processing method comprises a preprocessin...
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| creator | XIAO WENHUI DAI YIYI CHEN YUJIE TOSHIYASU KEN |
| description | The method is suitable for the technical field of BGA ball mounting packaging. The invention discloses a BGA (ball grid array) ball mounting high-definition image acquisition device and an image processing method. The BGA ball mounting high-definition image processing method comprises a preprocessing step of carrying out interference reduction on an original image, obtained under a low-angle shadowless annular light source, of a solder ball on a substrate, a solder ball measuring step of determining the diameter and the circle center position of the solder ball on the image obtained in the preprocessing step, and a step of identifying a measured solder ball graph. And a solder ball defect identification step of determining whether the solder ball has a defect, and determining that BGA ball mounting is successful when the solder ball defect identification step determines that the acquired BGA ball mounting image does not have the defect. Due to the fact that multiple defects in the ball mounting process are be |
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The invention discloses a BGA (ball grid array) ball mounting high-definition image acquisition device and an image processing method. The BGA ball mounting high-definition image processing method comprises a preprocessing step of carrying out interference reduction on an original image, obtained under a low-angle shadowless annular light source, of a solder ball on a substrate, a solder ball measuring step of determining the diameter and the circle center position of the solder ball on the image obtained in the preprocessing step, and a step of identifying a measured solder ball graph. And a solder ball defect identification step of determining whether the solder ball has a defect, and determining that BGA ball mounting is successful when the solder ball defect identification step determines that the acquired BGA ball mounting image does not have the defect. 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The invention discloses a BGA (ball grid array) ball mounting high-definition image acquisition device and an image processing method. The BGA ball mounting high-definition image processing method comprises a preprocessing step of carrying out interference reduction on an original image, obtained under a low-angle shadowless annular light source, of a solder ball on a substrate, a solder ball measuring step of determining the diameter and the circle center position of the solder ball on the image obtained in the preprocessing step, and a step of identifying a measured solder ball graph. And a solder ball defect identification step of determining whether the solder ball has a defect, and determining that BGA ball mounting is successful when the solder ball defect identification step determines that the acquired BGA ball mounting image does not have the defect. 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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | BGA (ball grid array) ball mounting high-definition image acquisition device and image processing method |
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