Embedded packaging structure and method and packaging substrate

The invention discloses an embedded packaging structure and method and a packaging substrate, and the structure comprises a substrate which is internally provided with a plurality of cavities; the silicon wafers are arranged inside the plurality of cavities; the filler is arranged inside the plurality of cavities and is used for wrapping the silicon wafer; and the metal coatings are arranged in the plurality of cavities, so that the silicon wafers in the different cavities are isolated through the metal coatings. According to the invention, the plurality of cavities are arranged in the substrate, the silicon wafers are placed in different cavities, and electromagnetic interference between the silicon wafers in different cavities can be shielded through the metal coatings arranged in the cavities. 本发明公开了一种嵌埋封装结构、方法和封装基板，其中结构包括：基板，基板的内部设置有若干空腔；硅晶片，设置在若干空腔的内部；填充物，设置在若干空腔的内部，用于包裹硅晶片；金属镀层，设置于若干空腔，使不同空腔内的硅晶片之间通过金属镀层进行隔离。本发明在基板的内部设置有多个空腔，硅晶片放入不同空腔，通过每个空腔设置的金属镀层能够使不同空腔的硅晶片之间屏蔽电磁干扰。