Composite LED packaging structure beneficial to heat dissipation
The composite LED packaging structure comprises a lampshade, a plurality of evenly-distributed LED lamp caps are installed at the bottom of the lampshade, the interiors of the LED lamp caps are each fixedly connected with two leads and a heat transfer tube, the heat transfer tubes penetrate through...
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| creator | WEI HAIHONG ZHANG JIREN ZHANG XINTAO WEI YONGFEI |
| description | The composite LED packaging structure comprises a lampshade, a plurality of evenly-distributed LED lamp caps are installed at the bottom of the lampshade, the interiors of the LED lamp caps are each fixedly connected with two leads and a heat transfer tube, the heat transfer tubes penetrate through the LED lamp caps and are fixedly connected with a heat dissipation disc, the outer wall of the heat dissipation disc is fixedly connected with a plurality of heat dissipation fins, and the heat dissipation fins are fixedly connected with the LED lamp caps. The two leads are respectively connected to two stages of a power supply, the LED lamp holder generates heat in the vacuum bulb, the heat is transferred to the epoxy resin packaging layer, the heat transfer tube is located on the lower side of the vacuum bulb but not connected with the outer wall of the vacuum bulb, and the heat transfer tube can absorb heat generated by heat radiation nearby and can also collect heat in the epoxy resin packaging layer. The heat |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117146244A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117146244A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117146244A3</originalsourceid><addsrcrecordid>eNrjZHBwzs8tyC_OLElV8HF1UShITM5OTM_MS1coLikqTS4pLUpVSErNS03LTM5MzFEoyVfISE0sUUjJLC7OLEgsyczP42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAA4HaS-Kd_QwNzQ1NzIxMTByNiVEDAMRJMU8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Composite LED packaging structure beneficial to heat dissipation</title><source>esp@cenet</source><creator>WEI HAIHONG ; ZHANG JIREN ; ZHANG XINTAO ; WEI YONGFEI</creator><creatorcontrib>WEI HAIHONG ; ZHANG JIREN ; ZHANG XINTAO ; WEI YONGFEI</creatorcontrib><description>The composite LED packaging structure comprises a lampshade, a plurality of evenly-distributed LED lamp caps are installed at the bottom of the lampshade, the interiors of the LED lamp caps are each fixedly connected with two leads and a heat transfer tube, the heat transfer tubes penetrate through the LED lamp caps and are fixedly connected with a heat dissipation disc, the outer wall of the heat dissipation disc is fixedly connected with a plurality of heat dissipation fins, and the heat dissipation fins are fixedly connected with the LED lamp caps. The two leads are respectively connected to two stages of a power supply, the LED lamp holder generates heat in the vacuum bulb, the heat is transferred to the epoxy resin packaging layer, the heat transfer tube is located on the lower side of the vacuum bulb but not connected with the outer wall of the vacuum bulb, and the heat transfer tube can absorb heat generated by heat radiation nearby and can also collect heat in the epoxy resin packaging layer. The heat</description><language>chi ; eng</language><subject>BLASTING ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED ; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR ; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL ; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE ; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS ; LIGHTING ; MECHANICAL ENGINEERING ; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231201&DB=EPODOC&CC=CN&NR=117146244A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231201&DB=EPODOC&CC=CN&NR=117146244A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEI HAIHONG</creatorcontrib><creatorcontrib>ZHANG JIREN</creatorcontrib><creatorcontrib>ZHANG XINTAO</creatorcontrib><creatorcontrib>WEI YONGFEI</creatorcontrib><title>Composite LED packaging structure beneficial to heat dissipation</title><description>The composite LED packaging structure comprises a lampshade, a plurality of evenly-distributed LED lamp caps are installed at the bottom of the lampshade, the interiors of the LED lamp caps are each fixedly connected with two leads and a heat transfer tube, the heat transfer tubes penetrate through the LED lamp caps and are fixedly connected with a heat dissipation disc, the outer wall of the heat dissipation disc is fixedly connected with a plurality of heat dissipation fins, and the heat dissipation fins are fixedly connected with the LED lamp caps. The two leads are respectively connected to two stages of a power supply, the LED lamp holder generates heat in the vacuum bulb, the heat is transferred to the epoxy resin packaging layer, the heat transfer tube is located on the lower side of the vacuum bulb but not connected with the outer wall of the vacuum bulb, and the heat transfer tube can absorb heat generated by heat radiation nearby and can also collect heat in the epoxy resin packaging layer. The heat</description><subject>BLASTING</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</subject><subject>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</subject><subject>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</subject><subject>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</subject><subject>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBwzs8tyC_OLElV8HF1UShITM5OTM_MS1coLikqTS4pLUpVSErNS03LTM5MzFEoyVfISE0sUUjJLC7OLEgsyczP42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAA4HaS-Kd_QwNzQ1NzIxMTByNiVEDAMRJMU8</recordid><startdate>20231201</startdate><enddate>20231201</enddate><creator>WEI HAIHONG</creator><creator>ZHANG JIREN</creator><creator>ZHANG XINTAO</creator><creator>WEI YONGFEI</creator><scope>EVB</scope></search><sort><creationdate>20231201</creationdate><title>Composite LED packaging structure beneficial to heat dissipation</title><author>WEI HAIHONG ; ZHANG JIREN ; ZHANG XINTAO ; WEI YONGFEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117146244A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BLASTING</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</topic><topic>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</topic><topic>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</topic><topic>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</topic><topic>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>WEI HAIHONG</creatorcontrib><creatorcontrib>ZHANG JIREN</creatorcontrib><creatorcontrib>ZHANG XINTAO</creatorcontrib><creatorcontrib>WEI YONGFEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEI HAIHONG</au><au>ZHANG JIREN</au><au>ZHANG XINTAO</au><au>WEI YONGFEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Composite LED packaging structure beneficial to heat dissipation</title><date>2023-12-01</date><risdate>2023</risdate><abstract>The composite LED packaging structure comprises a lampshade, a plurality of evenly-distributed LED lamp caps are installed at the bottom of the lampshade, the interiors of the LED lamp caps are each fixedly connected with two leads and a heat transfer tube, the heat transfer tubes penetrate through the LED lamp caps and are fixedly connected with a heat dissipation disc, the outer wall of the heat dissipation disc is fixedly connected with a plurality of heat dissipation fins, and the heat dissipation fins are fixedly connected with the LED lamp caps. The two leads are respectively connected to two stages of a power supply, the LED lamp holder generates heat in the vacuum bulb, the heat is transferred to the epoxy resin packaging layer, the heat transfer tube is located on the lower side of the vacuum bulb but not connected with the outer wall of the vacuum bulb, and the heat transfer tube can absorb heat generated by heat radiation nearby and can also collect heat in the epoxy resin packaging layer. The heat</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | Composite LED packaging structure beneficial to heat dissipation |
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