Shunt for bus-to-module connection
The invention relates to a shunt for bus-to-module connection. A test and measurement accessory has a shunt configured to be located in a current path between a busbar and an electronic module and configured to minimize a length increased to the current path, the shunt having an opening extending th...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention relates to a shunt for bus-to-module connection. A test and measurement accessory has a shunt configured to be located in a current path between a busbar and an electronic module and configured to minimize a length increased to the current path, the shunt having an opening extending through the shunt and a resistive portion, the resistive portion is configured to form part of a current path, and at least one of the contacts extends through the opening and is electrically insulated from the resistive portion of the shunt. A test and measurement accessory has a shunt, two or more contacts, at least one of the contacts extending through an opening, and a resistive portion including a plurality of resistors surrounding an insulating portion. A test and measurement accessory has a shunt including a gasket having an opening, a resistive portion, and two or more contacts.
本公开涉及用于母线至模块连接的分流器。一种测试和测量附属件具有分流器以及两个或更多个接触件,分流器被构造成位于母线和电子模块之间的电流路径中并且被构造成使增加到电流路径的长度最小化,分流器具有延伸穿过分流器的开口和电阻部分,电阻部分被构造成形成电流路径的一部分,所 |
---|