Compression-resistant heat-conducting glue applied to integrated circuit packaging, preparation method, application method and capsule curing agent

The invention discloses a compression-resistant heat-conducting adhesive applied to integrated circuit packaging, a preparation method, an application method and a capsule curing agent. The compression-resistant heat-conducting adhesive applied to integrated circuit packaging comprises the following...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	CHEN SHI, LIU YUFENG, TU ZHAOKANG, XIONG YONG, HUANG YONG, ZHOU YU, YANG LONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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