Compression-resistant heat-conducting glue applied to integrated circuit packaging, preparation method, application method and capsule curing agent

The invention discloses a compression-resistant heat-conducting adhesive applied to integrated circuit packaging, a preparation method, an application method and a capsule curing agent. The compression-resistant heat-conducting adhesive applied to integrated circuit packaging comprises the following components in parts by mass: 75-85 parts of heat-conducting metal oxide filler; 10 to 15 parts of epoxy resin; 20-30 parts of a self-made capsule curing agent; the particle size D50 of the heat-conducting metal oxide filler is smaller than or equal to 20 microns, the self-made capsule curing agent is powder of a capsule structure, the particle size of the self-made capsule curing agent is smaller than 40 microns, and the self-made capsule curing agent comprises a heat-conducting glass shell layer and a curing agent dispersed in the heat-conducting glass shell layer. According to the scheme, the problem that the curing agent is easily cured in advance in the storage and conveying processes can be solved, and meanwh