Adhesive for flexible electronic composite structure and preparation method thereof

The invention provides an adhesive for a flexible electronic composite structure and a preparation method of the adhesive, and solves the technical problems that an adhesive used for bonding an elastomer and hydrogel at present is relatively complex in preparation process and limited in adhesive for...

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Bibliographische Detailangaben
Hauptverfasser:	LI PENG, WANG ZEYI, WANG TENGJIAO, FAN RUIXIAO, LIU RONGJUN, HUANG WEI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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