Preparation method of stepped circuit board and stepped circuit board
The invention discloses a preparation method of a stepped circuit board and the stepped circuit board, and the method comprises the steps: covering a first region of a first surface of a first circuit board with a first protection layer, forming a bonding pad in the first region, and covering the bo...
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| creator | SUN SHUYONG ZHANG WANPENG XU BING |
| description | The invention discloses a preparation method of a stepped circuit board and the stepped circuit board, and the method comprises the steps: covering a first region of a first surface of a first circuit board with a first protection layer, forming a bonding pad in the first region, and covering the bonding pad with the first protection layer; a first bonding layer is formed on the first surface, and the first bonding layer covers the first circuit board and the first protection layer; a second circuit board is formed on the side, away from the first circuit board, of the first bonding layer, the second circuit board is bonded with the first circuit board through the first bonding layer, and the second circuit board covers the first bonding layer; cutting the second circuit board until the cutting depth reaches the surface, deviating from the first circuit board, of the first protection layer; and separating the first protection layer from the first circuit board so as to remove the second circuit board in the f |
| format | Patent |
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a first bonding layer is formed on the first surface, and the first bonding layer covers the first circuit board and the first protection layer; a second circuit board is formed on the side, away from the first circuit board, of the first bonding layer, the second circuit board is bonded with the first circuit board through the first bonding layer, and the second circuit board covers the first bonding layer; cutting the second circuit board until the cutting depth reaches the surface, deviating from the first circuit board, of the first protection layer; and separating the first protection layer from the first circuit board so as to remove the second circuit board in the f</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231117&DB=EPODOC&CC=CN&NR=117082764A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231117&DB=EPODOC&CC=CN&NR=117082764A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN SHUYONG</creatorcontrib><creatorcontrib>ZHANG WANPENG</creatorcontrib><creatorcontrib>XU BING</creatorcontrib><title>Preparation method of stepped circuit board and stepped circuit board</title><description>The invention discloses a preparation method of a stepped circuit board and the stepped circuit board, and the method comprises the steps: covering a first region of a first surface of a first circuit board with a first protection layer, forming a bonding pad in the first region, and covering the bonding pad with the first protection layer; 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Preparation method of stepped circuit board and stepped circuit board |
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