Packaging structure and preparation method thereof

The invention relates to a packaging structure and a preparation method thereof, and the packaging structure comprises a first chip structure which comprises a first wiring structure layer and a first chip, the first wiring structure layer comprises a first dielectric layer and a first wiring layer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	XU SITUO, ZHOU QIANG, ZHANG SHUJIN, YUAN XIAOMIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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