Packaging structure and preparation method thereof
The invention relates to a packaging structure and a preparation method thereof, and the packaging structure comprises a first chip structure which comprises a first wiring structure layer and a first chip, the first wiring structure layer comprises a first dielectric layer and a first wiring layer...
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| creator | XU SITUO ZHOU QIANG ZHANG SHUJIN YUAN XIAOMIN |
| description | The invention relates to a packaging structure and a preparation method thereof, and the packaging structure comprises a first chip structure which comprises a first wiring structure layer and a first chip, the first wiring structure layer comprises a first dielectric layer and a first wiring layer located in the first dielectric layer, and the first chip is located on the first wiring layer; the second wiring structure layer is located on one side of the first chip structure, the second wiring structure layer comprises a second dielectric layer and a second wiring layer located in the second dielectric layer, and the second wiring structure layer and the first wiring structure layer form a wiring structure layer; the second chip structure is located on the side, away from the first wiring structure layer, of the second wiring structure layer, and the second chip structure comprises a second chip. The first chip is connected with the second chip, and interconnection of chips in different planes is completed. |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Packaging structure and preparation method thereof |
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