Signal connection method, signal connection device and test system

A signal connection method, a signal connection device (201) and a test system (200), the method may comprise: configuring a first mapping relationship (S301) by means of the signal connection device (201), the first mapping relationship comprising a signal connection relationship between a module to be tested (203) and a hardware-in-the-loop (HIL) device (202); determining a third mapping relationship according to the first mapping relationship (S302), the third mapping relationship comprising a signal mapping relationship between the first processor (2042) and the HIL device (202); and determining a connection relationship of the HIL test according to the third mapping relationship (S303). By adopting the method, the signal connection configuration in the HIL test can be realized, and the development and verification efficiency is improved. 一种信号连接方法、信号连接装置(201)及测试系统(200)，该方法可以包括：通过信号连接装置(201)配置第一映射关系(S301)，该第一映射关系包含待测模块(203)和硬件在环HIL设备(202)之间的信号连接关系；根据第一映射关系确定第三映射关系(S302)，第三映射关系包含第一处理器(2042)和HIL设备(202)之间信号映射