Methods of forming microelectronic devices and related microelectronic devices, memory devices and electronic systems

A microelectronic device includes a stack structure, a step structure, a composite pad structure and a conductive contact structure. The stacked structure includes vertically alternating conductive structures and insulating structures arranged in a hierarchy. Each of the levels individually includes...

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Bibliographische Detailangaben
Hauptverfasser: GREENLEE JORDAN D, SCARBOROUGH ASHLEY N, HOPKINS JOHN D
Format: Patent
Sprache:chi ; eng
Schlagworte:
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