Structural analysis method for optimizing heat dissipation performance of TSV adapter plate through transient thermal resistance curve

The embodiment of the invention provides a structural analysis method for optimizing the heat dissipation performance of a TSV adapter plate through a transient thermal resistance curve. The method comprises the steps that TSV adapter plates with different TSV structure unit center point distances a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG KUNSHU, LIU YIN'AO, WANG BO, KONG ZEBIN, DU LIN, CHEN FAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING
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