SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

The purpose of the present invention is to facilitate the miniaturization of a semiconductor package in which pixels are provided. The semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In the semiconductor package, pixels are arranged...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AOKI SHUNPEI, ONO MASAYOSHI, BABA TOMOHIKO, SEKI AYAKA, KISHIDA, EIICHIRO, KOMORI ATSUKI, TANAKA TAKAMASA, HANAOKA SHUNSAKU, NAKAMURA TAKUYA, KEIGO YUKIHIDE, HARA YUJI
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The purpose of the present invention is to facilitate the miniaturization of a semiconductor package in which pixels are provided. The semiconductor package includes a transparent member, a semiconductor chip, a photosensitive rib, and an interposer. In the semiconductor package, pixels are arranged on a portion of a chip plane of a semiconductor chip. The photosensitive rib portion is a photosensitive resin disposed between a region that does not correspond to the pixel in a chip plane of the semiconductor chip and the transparent member. Further, the interposer is electrically connected to the semiconductor chip. 本发明使设置有像素的半导体封装的小型化变得容易。半导体封装包括透明部件、半导体芯片、感光性肋部和中介层。在该半导体封装中,像素被排列在半导体芯片的芯片平面的一部分上。感光性肋部是布置在半导体芯片的芯片平面中不对应于像素的区域和透明部件之间的感光性树脂。此外,中介层电气连接到半导体芯片。