SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

The present technology relates to a semiconductor package and an electronic device, the semiconductor package achieving higher reliability by having a configuration of a difference in coefficient of thermal expansion between an absorber substrate and a cover glass, thereby being capable of suppressing deterioration in characteristics. The semiconductor package is provided with a substrate, a chip disposed on the substrate, a frame body disposed on the substrate to surround the chip, and a cover glass disposed on the frame body; and the frame body is composed of a component including two or more materials. In addition, the structure of the frame body is provided with a cavity; and the part of the cavity on one side of the substrate and the part of the cavity on one side of the cover glass are formed in different sizes. This technology can be applied, for example, to a semiconductor package including an imaging element as a chip. 本技术涉及半导体封装件和电子设备，半导体封装件通过具有在吸收基板与盖玻璃之间的热膨胀系数差异的配置来实现更高的可靠性，从而能够抑制特性劣化。半导体封装件提供有基板、