Microphone and intelligent wearable device
The invention provides a microphone and an intelligent wearable device, the microphone comprises a bottom plate, a cover plate and a connecting plate connecting the bottom plate and the cover plate, the bottom plate, the cover plate and the connecting plate define an accommodating cavity, the accomm...
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creator | ZHU YAN LI ANHANG XU CHAO |
description | The invention provides a microphone and an intelligent wearable device, the microphone comprises a bottom plate, a cover plate and a connecting plate connecting the bottom plate and the cover plate, the bottom plate, the cover plate and the connecting plate define an accommodating cavity, the accommodating cavity is internally provided with a first MEMS chip, a first ASIC chip, a second MEMS chip, a mass piece and a connecting piece, the bottom plate is provided with a sound hole, and the bottom plate is provided with a sound hole. The first MEMS chip is arranged facing the sound hole, the first ASIC chip is respectively in signal connection with the bottom plate and the first MEMS chip, the mass piece is installed on the cover plate, the connecting piece is installed on the mass piece, the second MEMS chip is installed on the connecting piece, the connecting piece is provided with a through hole facing the second MEMS chip, and the second MEMS chip is in signal connection with the cover plate. According to t |
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The first MEMS chip is arranged facing the sound hole, the first ASIC chip is respectively in signal connection with the bottom plate and the first MEMS chip, the mass piece is installed on the cover plate, the connecting piece is installed on the mass piece, the second MEMS chip is installed on the connecting piece, the connecting piece is provided with a through hole facing the second MEMS chip, and the second MEMS chip is in signal connection with the cover plate. According to t</description><language>chi ; eng</language><subject>DEAF-AID SETS ; ELECTRIC COMMUNICATION TECHNIQUE ; ELECTRICITY ; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS ; PUBLIC ADDRESS SYSTEMS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231020&DB=EPODOC&CC=CN&NR=116916206A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231020&DB=EPODOC&CC=CN&NR=116916206A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHU YAN</creatorcontrib><creatorcontrib>LI ANHANG</creatorcontrib><creatorcontrib>XU CHAO</creatorcontrib><title>Microphone and intelligent wearable device</title><description>The invention provides a microphone and an intelligent wearable device, the microphone comprises a bottom plate, a cover plate and a connecting plate connecting the bottom plate and the cover plate, the bottom plate, the cover plate and the connecting plate define an accommodating cavity, the accommodating cavity is internally provided with a first MEMS chip, a first ASIC chip, a second MEMS chip, a mass piece and a connecting piece, the bottom plate is provided with a sound hole, and the bottom plate is provided with a sound hole. The first MEMS chip is arranged facing the sound hole, the first ASIC chip is respectively in signal connection with the bottom plate and the first MEMS chip, the mass piece is installed on the cover plate, the connecting piece is installed on the mass piece, the second MEMS chip is installed on the connecting piece, the connecting piece is provided with a through hole facing the second MEMS chip, and the second MEMS chip is in signal connection with the cover plate. According to t</description><subject>DEAF-AID SETS</subject><subject>ELECTRIC COMMUNICATION TECHNIQUE</subject><subject>ELECTRICITY</subject><subject>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</subject><subject>PUBLIC ADDRESS SYSTEMS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNDyzUwuyi_IyM9LVUjMS1HIzCtJzcnJTE_NK1EoT00sSkzKSVVISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhmaWhmZGBmaOxsSoAQBBdCkq</recordid><startdate>20231020</startdate><enddate>20231020</enddate><creator>ZHU YAN</creator><creator>LI ANHANG</creator><creator>XU CHAO</creator><scope>EVB</scope></search><sort><creationdate>20231020</creationdate><title>Microphone and intelligent wearable device</title><author>ZHU YAN ; LI ANHANG ; XU CHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116916206A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DEAF-AID SETS</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRICITY</topic><topic>LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS</topic><topic>PUBLIC ADDRESS SYSTEMS</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHU YAN</creatorcontrib><creatorcontrib>LI ANHANG</creatorcontrib><creatorcontrib>XU CHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHU YAN</au><au>LI ANHANG</au><au>XU CHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Microphone and intelligent wearable device</title><date>2023-10-20</date><risdate>2023</risdate><abstract>The invention provides a microphone and an intelligent wearable device, the microphone comprises a bottom plate, a cover plate and a connecting plate connecting the bottom plate and the cover plate, the bottom plate, the cover plate and the connecting plate define an accommodating cavity, the accommodating cavity is internally provided with a first MEMS chip, a first ASIC chip, a second MEMS chip, a mass piece and a connecting piece, the bottom plate is provided with a sound hole, and the bottom plate is provided with a sound hole. The first MEMS chip is arranged facing the sound hole, the first ASIC chip is respectively in signal connection with the bottom plate and the first MEMS chip, the mass piece is installed on the cover plate, the connecting piece is installed on the mass piece, the second MEMS chip is installed on the connecting piece, the connecting piece is provided with a through hole facing the second MEMS chip, and the second MEMS chip is in signal connection with the cover plate. According to t</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
recordid | cdi_epo_espacenet_CN116916206A |
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subjects | DEAF-AID SETS ELECTRIC COMMUNICATION TECHNIQUE ELECTRICITY LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS PUBLIC ADDRESS SYSTEMS |
title | Microphone and intelligent wearable device |
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