Substrate processing apparatus

The present disclosure provides a substrate processing apparatus including: an electrostatic chuck disposed on a susceptor to support a substrate; a focus ring disposed on the base so as to surround the outer periphery of the electrostatic chuck; and a lift pin configured to lift the focus ring, in which the focus ring includes a lower ring and an upper ring provided on the lower ring, the upper ring and/or the lower ring is configured to simultaneously lift according to a height of the lift pin, the lower ring includes an insertion groove, and the upper ring includes: a main body unit; a first protrusion extending downward from the main body unit and inserted into the insertion groove of the lower ring; and a second protrusion extending downward from the main body unit, contacting an outer periphery of the lower ring, and directly contacting the lift pin. 本公开提供了基板处理装置，其包括：静电卡盘，设置在基座上以支承基板；聚焦环，在基座上设置成围绕静电卡盘的外周；以及提升销，被配置成使聚焦环升降，其中，聚焦环包括下环和设置在下环上的上环，上环和/或下环被配置成根据提升销的高度同时升降，下环包括插入槽，上环包括：主体单元；第一突起部，从主体单元向下延伸并且插入到