Mini LED circuit board expansion and contraction control method
The invention provides a Mini LED circuit board expansion and shrinkage control method, which comprises the following steps that: cutting is carried out, the board baking parameter is 150 DEG C * 4H, and the stacking height of each layer does not exceed 5cm; an inner layer circuit is produced by an...
Gespeichert in:
| Hauptverfasser: | , , , , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HE ZIXIU HE BO LI ZHUOTAO DENG WANQUAN DENG ZI CHENG SONGQI YI ZIFENG WU HANGJIE CHENG YONG WEI HUAZHAO QIAN PIAOCHENG |
| description | The invention provides a Mini LED circuit board expansion and shrinkage control method, which comprises the following steps that: cutting is carried out, the board baking parameter is 150 DEG C * 4H, and the stacking height of each layer does not exceed 5cm; an inner layer circuit is produced by an LDI machine, the temperature is controlled to be 22 +/-2 DEG C, and the humidity is controlled to be 55 +/-5%; the storage time is shorter than 24 hours after the PP is cut, the pressing expansion and shrinkage are divided into piles according to +/-2 mil, 10 plates are measured for each pile, and the expansion and shrinkage coefficient is calculated; drilling is conducted, the precision of a drilling machine is required to be +/-0.076 mm, and the number of stacked plates does not exceed 5 PNL; electroplating, reworking and board grinding are prohibited, and the pretreatment time from VCP to the circuit is less than 24 hours; according to the outer layer circuit, the temperature is controlled at 22 +/-2 DEG C, and |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116867189A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116867189A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116867189A3</originalsourceid><addsrcrecordid>eNrjZLD3zczLVPBxdVFIzixKLs0sUUjKTyxKUUitKEjMK87Mz1NIzEtRSM7PKylKTC4B8cHs_ByF3NSSjPwUHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGhmYWZuaGHpaEyMGgBi3DDP</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Mini LED circuit board expansion and contraction control method</title><source>esp@cenet</source><creator>HE ZIXIU ; HE BO ; LI ZHUOTAO ; DENG WANQUAN ; DENG ZI ; CHENG SONGQI ; YI ZIFENG ; WU HANGJIE ; CHENG YONG ; WEI HUAZHAO ; QIAN PIAOCHENG</creator><creatorcontrib>HE ZIXIU ; HE BO ; LI ZHUOTAO ; DENG WANQUAN ; DENG ZI ; CHENG SONGQI ; YI ZIFENG ; WU HANGJIE ; CHENG YONG ; WEI HUAZHAO ; QIAN PIAOCHENG</creatorcontrib><description>The invention provides a Mini LED circuit board expansion and shrinkage control method, which comprises the following steps that: cutting is carried out, the board baking parameter is 150 DEG C * 4H, and the stacking height of each layer does not exceed 5cm; an inner layer circuit is produced by an LDI machine, the temperature is controlled to be 22 +/-2 DEG C, and the humidity is controlled to be 55 +/-5%; the storage time is shorter than 24 hours after the PP is cut, the pressing expansion and shrinkage are divided into piles according to +/-2 mil, 10 plates are measured for each pile, and the expansion and shrinkage coefficient is calculated; drilling is conducted, the precision of a drilling machine is required to be +/-0.076 mm, and the number of stacked plates does not exceed 5 PNL; electroplating, reworking and board grinding are prohibited, and the pretreatment time from VCP to the circuit is less than 24 hours; according to the outer layer circuit, the temperature is controlled at 22 +/-2 DEG C, and</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231010&DB=EPODOC&CC=CN&NR=116867189A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231010&DB=EPODOC&CC=CN&NR=116867189A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HE ZIXIU</creatorcontrib><creatorcontrib>HE BO</creatorcontrib><creatorcontrib>LI ZHUOTAO</creatorcontrib><creatorcontrib>DENG WANQUAN</creatorcontrib><creatorcontrib>DENG ZI</creatorcontrib><creatorcontrib>CHENG SONGQI</creatorcontrib><creatorcontrib>YI ZIFENG</creatorcontrib><creatorcontrib>WU HANGJIE</creatorcontrib><creatorcontrib>CHENG YONG</creatorcontrib><creatorcontrib>WEI HUAZHAO</creatorcontrib><creatorcontrib>QIAN PIAOCHENG</creatorcontrib><title>Mini LED circuit board expansion and contraction control method</title><description>The invention provides a Mini LED circuit board expansion and shrinkage control method, which comprises the following steps that: cutting is carried out, the board baking parameter is 150 DEG C * 4H, and the stacking height of each layer does not exceed 5cm; an inner layer circuit is produced by an LDI machine, the temperature is controlled to be 22 +/-2 DEG C, and the humidity is controlled to be 55 +/-5%; the storage time is shorter than 24 hours after the PP is cut, the pressing expansion and shrinkage are divided into piles according to +/-2 mil, 10 plates are measured for each pile, and the expansion and shrinkage coefficient is calculated; drilling is conducted, the precision of a drilling machine is required to be +/-0.076 mm, and the number of stacked plates does not exceed 5 PNL; electroplating, reworking and board grinding are prohibited, and the pretreatment time from VCP to the circuit is less than 24 hours; according to the outer layer circuit, the temperature is controlled at 22 +/-2 DEG C, and</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD3zczLVPBxdVFIzixKLs0sUUjKTyxKUUitKEjMK87Mz1NIzEtRSM7PKylKTC4B8cHs_ByF3NSSjPwUHgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWlyQmJyal1oS7-xnaGhmYWZuaGHpaEyMGgBi3DDP</recordid><startdate>20231010</startdate><enddate>20231010</enddate><creator>HE ZIXIU</creator><creator>HE BO</creator><creator>LI ZHUOTAO</creator><creator>DENG WANQUAN</creator><creator>DENG ZI</creator><creator>CHENG SONGQI</creator><creator>YI ZIFENG</creator><creator>WU HANGJIE</creator><creator>CHENG YONG</creator><creator>WEI HUAZHAO</creator><creator>QIAN PIAOCHENG</creator><scope>EVB</scope></search><sort><creationdate>20231010</creationdate><title>Mini LED circuit board expansion and contraction control method</title><author>HE ZIXIU ; HE BO ; LI ZHUOTAO ; DENG WANQUAN ; DENG ZI ; CHENG SONGQI ; YI ZIFENG ; WU HANGJIE ; CHENG YONG ; WEI HUAZHAO ; QIAN PIAOCHENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116867189A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>HE ZIXIU</creatorcontrib><creatorcontrib>HE BO</creatorcontrib><creatorcontrib>LI ZHUOTAO</creatorcontrib><creatorcontrib>DENG WANQUAN</creatorcontrib><creatorcontrib>DENG ZI</creatorcontrib><creatorcontrib>CHENG SONGQI</creatorcontrib><creatorcontrib>YI ZIFENG</creatorcontrib><creatorcontrib>WU HANGJIE</creatorcontrib><creatorcontrib>CHENG YONG</creatorcontrib><creatorcontrib>WEI HUAZHAO</creatorcontrib><creatorcontrib>QIAN PIAOCHENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HE ZIXIU</au><au>HE BO</au><au>LI ZHUOTAO</au><au>DENG WANQUAN</au><au>DENG ZI</au><au>CHENG SONGQI</au><au>YI ZIFENG</au><au>WU HANGJIE</au><au>CHENG YONG</au><au>WEI HUAZHAO</au><au>QIAN PIAOCHENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Mini LED circuit board expansion and contraction control method</title><date>2023-10-10</date><risdate>2023</risdate><abstract>The invention provides a Mini LED circuit board expansion and shrinkage control method, which comprises the following steps that: cutting is carried out, the board baking parameter is 150 DEG C * 4H, and the stacking height of each layer does not exceed 5cm; an inner layer circuit is produced by an LDI machine, the temperature is controlled to be 22 +/-2 DEG C, and the humidity is controlled to be 55 +/-5%; the storage time is shorter than 24 hours after the PP is cut, the pressing expansion and shrinkage are divided into piles according to +/-2 mil, 10 plates are measured for each pile, and the expansion and shrinkage coefficient is calculated; drilling is conducted, the precision of a drilling machine is required to be +/-0.076 mm, and the number of stacked plates does not exceed 5 PNL; electroplating, reworking and board grinding are prohibited, and the pretreatment time from VCP to the circuit is less than 24 hours; according to the outer layer circuit, the temperature is controlled at 22 +/-2 DEG C, and</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN116867189A |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Mini LED circuit board expansion and contraction control method |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-13T05%3A38%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HE%20ZIXIU&rft.date=2023-10-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116867189A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |