Mini LED circuit board expansion and contraction control method

The invention provides a Mini LED circuit board expansion and shrinkage control method, which comprises the following steps that: cutting is carried out, the board baking parameter is 150 DEG C * 4H, and the stacking height of each layer does not exceed 5cm; an inner layer circuit is produced by an LDI machine, the temperature is controlled to be 22 +/-2 DEG C, and the humidity is controlled to be 55 +/-5%; the storage time is shorter than 24 hours after the PP is cut, the pressing expansion and shrinkage are divided into piles according to +/-2 mil, 10 plates are measured for each pile, and the expansion and shrinkage coefficient is calculated; drilling is conducted, the precision of a drilling machine is required to be +/-0.076 mm, and the number of stacked plates does not exceed 5 PNL; electroplating, reworking and board grinding are prohibited, and the pretreatment time from VCP to the circuit is less than 24 hours; according to the outer layer circuit, the temperature is controlled at 22 +/-2 DEG C, and