Cavity packaging structure and forming method thereof

The invention discloses a cavity packaging structure and a forming method thereof, the cavity packaging structure comprises a metal substrate, the metal substrate comprises a middle area and an edge area surrounding the middle area, the middle area comprises a mounting area, a causeway structure is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU TING, YU KAIYUAN, ZHANG YUESHENG, PU HU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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