High-heat-dissipation circuit board and preparation method thereof

The invention relates to the technical field of circuit boards, and discloses a high-heat-dissipation circuit board and a preparation method thereof. The high-heat-dissipation circuit board comprises a cooling fin, a heat conduction insulating layer and a circuit layer. The heat-conducting insulating layer comprises the following raw materials in parts by mass: 90-110 parts of epoxy resin, 15-25 parts of an additive, 10-20 parts of modified granular boron nitride, 8-12 parts of ethylene glycol glycidyl ether and 45-55 parts of a polyamide curing agent; the additive is prepared from the following raw materials in parts by mass: 20 to 30 parts of a reinforcing component, 20 to 30 parts of carboxyl polyimide, 0.05 to 0.1 part of sulfamic acid and 8 to 12 parts of modified flaky boron nitride; the reinforcing component is prepared from the following raw materials in parts by mass: 20 to 30 parts of N-methyldiethanolamine, 6 to 10 parts of hexamethoxymethyl melamine, 0.05 to 0.1 part of sulfamic acid, 60 to 80 par