Flexible array for acoustic emission monitoring of circumferential cracks of pipeline circumferential weld and preparation method

The invention relates to the technical field of nondestructive testing, in particular to a flexible array for acoustic emission monitoring of circumferential cracks of a pipeline circumferential weld and a preparation method thereof, and the preparation method comprises the following steps: research...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: HU PAN, HUA LIANG, SHI RUNMIAO, WANG SI, MU ZIXUAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HU PAN
HUA LIANG
SHI RUNMIAO
WANG SI
MU ZIXUAN
description The invention relates to the technical field of nondestructive testing, in particular to a flexible array for acoustic emission monitoring of circumferential cracks of a pipeline circumferential weld and a preparation method thereof, and the preparation method comprises the following steps: researching acoustic emission propagation characteristics of the circumferential cracks of the pipeline circumferential weld by means of an extended finite element method; establishing a pipeline circumferential weld circumferential crack acoustic emission array model, analyzing a beam pattern of an array, and determining the number of piezoelectric ceramic sensors; a two-column sensor topology mode is designed, and a flexible array is manufactured by means of a flexible printed circuit technology. The flexible array comprises a flexible polyimide film, a printed circuit, an SMA communication interface and eight piezoelectric ceramic sensors. The sensing array applied to circumferential crack monitoring of the circumferent
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN116840350A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN116840350A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN116840350A3</originalsourceid><addsrcrecordid>eNqNjLEKwjAQQLs4iPoP5wcILVVxlWJxcnIvZ3rRwyQXLinq6J-L4ubi9Ib3eOPi2Tq688kRoCo-wIoCGhlSZgPkOSWWAF4CZ1EOZxALhtUM3pJSyIwOjKK5preJHMlxoJ_kRq4HDD1EpYiK-XOlfJF-WowsukSzLyfFvN0dm_2ConSUIhoKlLvmUFXrzbKsV-W2_qd5AT0wSs8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Flexible array for acoustic emission monitoring of circumferential cracks of pipeline circumferential weld and preparation method</title><source>esp@cenet</source><creator>HU PAN ; HUA LIANG ; SHI RUNMIAO ; WANG SI ; MU ZIXUAN</creator><creatorcontrib>HU PAN ; HUA LIANG ; SHI RUNMIAO ; WANG SI ; MU ZIXUAN</creatorcontrib><description>The invention relates to the technical field of nondestructive testing, in particular to a flexible array for acoustic emission monitoring of circumferential cracks of a pipeline circumferential weld and a preparation method thereof, and the preparation method comprises the following steps: researching acoustic emission propagation characteristics of the circumferential cracks of the pipeline circumferential weld by means of an extended finite element method; establishing a pipeline circumferential weld circumferential crack acoustic emission array model, analyzing a beam pattern of an array, and determining the number of piezoelectric ceramic sensors; a two-column sensor topology mode is designed, and a flexible array is manufactured by means of a flexible printed circuit technology. The flexible array comprises a flexible polyimide film, a printed circuit, an SMA communication interface and eight piezoelectric ceramic sensors. The sensing array applied to circumferential crack monitoring of the circumferent</description><language>chi ; eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231003&amp;DB=EPODOC&amp;CC=CN&amp;NR=116840350A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20231003&amp;DB=EPODOC&amp;CC=CN&amp;NR=116840350A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HU PAN</creatorcontrib><creatorcontrib>HUA LIANG</creatorcontrib><creatorcontrib>SHI RUNMIAO</creatorcontrib><creatorcontrib>WANG SI</creatorcontrib><creatorcontrib>MU ZIXUAN</creatorcontrib><title>Flexible array for acoustic emission monitoring of circumferential cracks of pipeline circumferential weld and preparation method</title><description>The invention relates to the technical field of nondestructive testing, in particular to a flexible array for acoustic emission monitoring of circumferential cracks of a pipeline circumferential weld and a preparation method thereof, and the preparation method comprises the following steps: researching acoustic emission propagation characteristics of the circumferential cracks of the pipeline circumferential weld by means of an extended finite element method; establishing a pipeline circumferential weld circumferential crack acoustic emission array model, analyzing a beam pattern of an array, and determining the number of piezoelectric ceramic sensors; a two-column sensor topology mode is designed, and a flexible array is manufactured by means of a flexible printed circuit technology. The flexible array comprises a flexible polyimide film, a printed circuit, an SMA communication interface and eight piezoelectric ceramic sensors. The sensing array applied to circumferential crack monitoring of the circumferent</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLEKwjAQQLs4iPoP5wcILVVxlWJxcnIvZ3rRwyQXLinq6J-L4ubi9Ib3eOPi2Tq688kRoCo-wIoCGhlSZgPkOSWWAF4CZ1EOZxALhtUM3pJSyIwOjKK5preJHMlxoJ_kRq4HDD1EpYiK-XOlfJF-WowsukSzLyfFvN0dm_2ConSUIhoKlLvmUFXrzbKsV-W2_qd5AT0wSs8</recordid><startdate>20231003</startdate><enddate>20231003</enddate><creator>HU PAN</creator><creator>HUA LIANG</creator><creator>SHI RUNMIAO</creator><creator>WANG SI</creator><creator>MU ZIXUAN</creator><scope>EVB</scope></search><sort><creationdate>20231003</creationdate><title>Flexible array for acoustic emission monitoring of circumferential cracks of pipeline circumferential weld and preparation method</title><author>HU PAN ; HUA LIANG ; SHI RUNMIAO ; WANG SI ; MU ZIXUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116840350A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HU PAN</creatorcontrib><creatorcontrib>HUA LIANG</creatorcontrib><creatorcontrib>SHI RUNMIAO</creatorcontrib><creatorcontrib>WANG SI</creatorcontrib><creatorcontrib>MU ZIXUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HU PAN</au><au>HUA LIANG</au><au>SHI RUNMIAO</au><au>WANG SI</au><au>MU ZIXUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Flexible array for acoustic emission monitoring of circumferential cracks of pipeline circumferential weld and preparation method</title><date>2023-10-03</date><risdate>2023</risdate><abstract>The invention relates to the technical field of nondestructive testing, in particular to a flexible array for acoustic emission monitoring of circumferential cracks of a pipeline circumferential weld and a preparation method thereof, and the preparation method comprises the following steps: researching acoustic emission propagation characteristics of the circumferential cracks of the pipeline circumferential weld by means of an extended finite element method; establishing a pipeline circumferential weld circumferential crack acoustic emission array model, analyzing a beam pattern of an array, and determining the number of piezoelectric ceramic sensors; a two-column sensor topology mode is designed, and a flexible array is manufactured by means of a flexible printed circuit technology. The flexible array comprises a flexible polyimide film, a printed circuit, an SMA communication interface and eight piezoelectric ceramic sensors. The sensing array applied to circumferential crack monitoring of the circumferent</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN116840350A
source esp@cenet
subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Flexible array for acoustic emission monitoring of circumferential cracks of pipeline circumferential weld and preparation method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T11%3A25%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HU%20PAN&rft.date=2023-10-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN116840350A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true