ELECTRONIC DEVICE WITH HEAT PIPE CONNECTED TO HOUSING WALL

The invention relates to an electronic device having a heat pipe connected to a housing wall, in particular a controller for a motor vehicle. The invention relates to an electronic device, comprising a housing, which is in particular sealed in a media-tight manner, and at least one or only one elect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GEBERS JOERG, LORENZ MICHAEL, MEINKE GERALD, GREEN KYLE, STRAUB HEIKO, FREY, YANN, F
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention relates to an electronic device having a heat pipe connected to a housing wall, in particular a controller for a motor vehicle. The invention relates to an electronic device, comprising a housing, which is in particular sealed in a media-tight manner, and at least one or only one electronic component, in particular a semiconductor component, which generates heat loss. The device also has a heat sink, the component, in particular the semiconductor component, being connected to the heat sink in a thermally conductive manner. The heat dissipation piece is provided with a heat pipe. According to the invention, the component, in particular the semiconductor component, is connected to the housing wall of the housing in a thermally conductive manner. The heat pipe, in particular in the region of a component, in particular a semiconductor component, is designed as a part of a housing wall of the housing. In order to form the heat pipe, the housing wall is connected to the heat pipe wall in a material co