Packaging structure, manufacturing method thereof and electronic equipment
The invention relates to a packaging structure, a manufacturing method thereof and electronic equipment. The packaging structure comprises at least two bare chips; the first plastic package layer wraps each bare chip and exposes the plurality of first bumps of each bare chip; a first connecting laye...
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| creator | JIANG SHANGXUAN ZHAO NAN HU XIAO |
| description | The invention relates to a packaging structure, a manufacturing method thereof and electronic equipment. The packaging structure comprises at least two bare chips; the first plastic package layer wraps each bare chip and exposes the plurality of first bumps of each bare chip; a first connecting layer and a second connecting layer, each connecting layer comprises a substrate and a rewiring layer which covers the first surface of the substrate and is electrically connected with a plurality of via holes of the substrate, the substrate is a glass substrate, and the plurality of connecting layers comprise a plurality of connecting layers; the first connecting layer is arranged on the surface, where the plurality of first bumps of the bare chips are exposed, of the first plastic packaging layer, the plurality of first bumps of the bare chips are electrically connected to the rewiring layer in the first connecting layer, and the space between the first connecting layer and each bare chip is filled with the first fil |
| format | Patent |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Packaging structure, manufacturing method thereof and electronic equipment |
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