Wafer heating equipment

A wafer heating device provided by the present invention comprises a heating main body and a bearing plate covering the top surface of the heating main body, the heating main body and the bearing plate define a heating chamber, a heat transfer medium is injected into the heating chamber, the heating chamber is communicated with a heat exchange conduit, and the heat exchange conduit is communicated with the bearing plate. The other end of the heat exchange guide pipe penetrates through a heat exchange device and then is communicated with the heating cavity, and a heat exchange medium used for cooling the heat transfer medium flowing through the heat exchange guide pipe is injected into the heat exchange device. The invention is used for solving the problem that the whole process efficiency of the wafer is influenced when the subsequent heating step needs cooling due to the fact that the cooling time of the wafer heater in the prior art is too long. 本发明提供了一种晶圆加热设备，包括加热主体和覆盖于所述加热主体顶面的承托板，所述加热主体与承托板围成加热腔室，所述加热腔室内