Magnetic field sensor with mechanically protected permanent magnet
The embodiment of the invention relates to a magnetic field sensor with a mechanically protected permanent magnet. The invention relates to a magnetic field sensor (0600), comprising: a semiconductor chip (0111), the semiconductor chip (0111) having at least one magnetic field sensor element (0112),...
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| creator | HILLAN KLAUS DANGELMAIER JOCHEN SCHALLER ROBERT |
| description | The embodiment of the invention relates to a magnetic field sensor with a mechanically protected permanent magnet. The invention relates to a magnetic field sensor (0600), comprising: a semiconductor chip (0111), the semiconductor chip (0111) having at least one magnetic field sensor element (0112), the semiconductor chip (0111) being embedded in a semiconductor chip package; the permanent magnet is embedded in the magnet packaging part, and a boundary layer between the semiconductor chip packaging part and the magnet packaging part extends to the exposed surface of the magnetic field sensor. A method for manufacturing a magnetic field sensor is also disclosed.
本公开的实施例涉及带机械保护的永磁体的磁场传感器。提出一种磁场传感器(0600)，带有：半导体芯片(0111)的，其中半导体芯片(0111)具有至少一个磁场传感器元件(0112)，其中半导体芯片(0111)嵌入半导体芯片封装部中；永磁体，其中永磁体嵌入磁体封装部中，其中在半导体芯片封装部与磁体封装部之间的边界层延伸直至磁场传感器的裸露表面。还公开了用于制造磁场传感器的方法。 |
| format | Patent |
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本公开的实施例涉及带机械保护的永磁体的磁场传感器。提出一种磁场传感器(0600)，带有：半导体芯片(0111)的，其中半导体芯片(0111)具有至少一个磁场传感器元件(0112)，其中半导体芯片(0111)嵌入半导体芯片封装部中；永磁体，其中永磁体嵌入磁体封装部中，其中在半导体芯片封装部与磁体封装部之间的边界层延伸直至磁场传感器的裸露表面。还公开了用于制造磁场传感器的方法。</description><language>chi ; eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230912&DB=EPODOC&CC=CN&NR=116736195A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230912&DB=EPODOC&CC=CN&NR=116736195A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HILLAN KLAUS</creatorcontrib><creatorcontrib>DANGELMAIER JOCHEN</creatorcontrib><creatorcontrib>SCHALLER ROBERT</creatorcontrib><title>Magnetic field sensor with mechanically protected permanent magnet</title><description>The embodiment of the invention relates to a magnetic field sensor with a mechanically protected permanent magnet. The invention relates to a magnetic field sensor (0600), comprising: a semiconductor chip (0111), the semiconductor chip (0111) having at least one magnetic field sensor element (0112), the semiconductor chip (0111) being embedded in a semiconductor chip package; the permanent magnet is embedded in the magnet packaging part, and a boundary layer between the semiconductor chip packaging part and the magnet packaging part extends to the exposed surface of the magnetic field sensor. A method for manufacturing a magnetic field sensor is also disclosed.
本公开的实施例涉及带机械保护的永磁体的磁场传感器。提出一种磁场传感器(0600)，带有：半导体芯片(0111)的，其中半导体芯片(0111)具有至少一个磁场传感器元件(0112)，其中半导体芯片(0111)嵌入半导体芯片封装部中；永磁体，其中永磁体嵌入磁体封装部中，其中在半导体芯片封装部与磁体封装部之间的边界层延伸直至磁场传感器的裸露表面。还公开了用于制造磁场传感器的方法。</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDyTUzPSy3JTFZIy0zNSVEoTs0rzi9SKM8syVDITU3OSMzLTE7MyalUKCjKL0lNLklNUShILcpNzEvNK1HIBevlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyalAVfHOfoaGZubGZoaWpo7GxKgBAHL-MpM</recordid><startdate>20230912</startdate><enddate>20230912</enddate><creator>HILLAN KLAUS</creator><creator>DANGELMAIER JOCHEN</creator><creator>SCHALLER ROBERT</creator><scope>EVB</scope></search><sort><creationdate>20230912</creationdate><title>Magnetic field sensor with mechanically protected permanent magnet</title><author>HILLAN KLAUS ; DANGELMAIER JOCHEN ; SCHALLER ROBERT</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116736195A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HILLAN KLAUS</creatorcontrib><creatorcontrib>DANGELMAIER JOCHEN</creatorcontrib><creatorcontrib>SCHALLER ROBERT</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HILLAN KLAUS</au><au>DANGELMAIER JOCHEN</au><au>SCHALLER ROBERT</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Magnetic field sensor with mechanically protected permanent magnet</title><date>2023-09-12</date><risdate>2023</risdate><abstract>The embodiment of the invention relates to a magnetic field sensor with a mechanically protected permanent magnet. The invention relates to a magnetic field sensor (0600), comprising: a semiconductor chip (0111), the semiconductor chip (0111) having at least one magnetic field sensor element (0112), the semiconductor chip (0111) being embedded in a semiconductor chip package; the permanent magnet is embedded in the magnet packaging part, and a boundary layer between the semiconductor chip packaging part and the magnet packaging part extends to the exposed surface of the magnetic field sensor. A method for manufacturing a magnetic field sensor is also disclosed.
本公开的实施例涉及带机械保护的永磁体的磁场传感器。提出一种磁场传感器(0600)，带有：半导体芯片(0111)的，其中半导体芯片(0111)具有至少一个磁场传感器元件(0112)，其中半导体芯片(0111)嵌入半导体芯片封装部中；永磁体，其中永磁体嵌入磁体封装部中，其中在半导体芯片封装部与磁体封装部之间的边界层延伸直至磁场传感器的裸露表面。还公开了用于制造磁场传感器的方法。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
| title | Magnetic field sensor with mechanically protected permanent magnet |
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