Method for improving focused ion beam FIB etching morphology quality

The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB...

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description The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB etching base is heated and rotates in a horizontal plane or a non-horizontal plane, so that the to-be-etched sample rotates at multiple angles, and the same or different FIB etching time is kept at each rotation angle; in the FIB etching process or after FIB etching, auxiliary etching is carried out on the sample to be etched; and removing the mask layer. 本发明实施例涉及一种提高聚焦离子束FIB刻蚀形貌质量的方法,包括:在待刻蚀样本上制作掩膜层;将待刻蚀样本固定在FIB刻蚀基座上;在FIB刻蚀过程中,对所述FIB刻蚀基座进行加热,并在水平面或非水平面内进行旋转,使得待刻蚀样本发生多角度旋转,并在每个旋转角度上保持相同或不同的FIB刻蚀时间;在FIB刻蚀过程中或FIB刻蚀之后,对所述待刻蚀样本进行辅助刻蚀;去除所述掩膜层。
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The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB etching base is heated and rotates in a horizontal plane or a non-horizontal plane, so that the to-be-etched sample rotates at multiple angles, and the same or different FIB etching time is kept at each rotation angle; in the FIB etching process or after FIB etching, auxiliary etching is carried out on the sample to be etched; and removing the mask layer. 本发明实施例涉及一种提高聚焦离子束FIB刻蚀形貌质量的方法,包括:在待刻蚀样本上制作掩膜层;将待刻蚀样本固定在FIB刻蚀基座上;在FIB刻蚀过程中,对所述FIB刻蚀基座进行加热,并在水平面或非水平面内进行旋转,使得待刻蚀样本发生多角度旋转,并在每个旋转角度上保持相同或不同的FIB刻蚀时间;在FIB刻蚀过程中或FIB刻蚀之后,对所述待刻蚀样本进行辅助刻蚀;去除所述掩膜层。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230901&amp;DB=EPODOC&amp;CC=CN&amp;NR=116682727A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230901&amp;DB=EPODOC&amp;CC=CN&amp;NR=116682727A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO SHAOFENG</creatorcontrib><title>Method for improving focused ion beam FIB etching morphology quality</title><description>The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for improving focused ion beam FIB etching morphology quality
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