Method for improving focused ion beam FIB etching morphology quality
The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB...
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creator | ZHAO SHAOFENG |
description | The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB etching base is heated and rotates in a horizontal plane or a non-horizontal plane, so that the to-be-etched sample rotates at multiple angles, and the same or different FIB etching time is kept at each rotation angle; in the FIB etching process or after FIB etching, auxiliary etching is carried out on the sample to be etched; and removing the mask layer.
本发明实施例涉及一种提高聚焦离子束FIB刻蚀形貌质量的方法,包括:在待刻蚀样本上制作掩膜层;将待刻蚀样本固定在FIB刻蚀基座上;在FIB刻蚀过程中,对所述FIB刻蚀基座进行加热,并在水平面或非水平面内进行旋转,使得待刻蚀样本发生多角度旋转,并在每个旋转角度上保持相同或不同的FIB刻蚀时间;在FIB刻蚀过程中或FIB刻蚀之后,对所述待刻蚀样本进行辅助刻蚀;去除所述掩膜层。 |
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本发明实施例涉及一种提高聚焦离子束FIB刻蚀形貌质量的方法,包括:在待刻蚀样本上制作掩膜层;将待刻蚀样本固定在FIB刻蚀基座上;在FIB刻蚀过程中,对所述FIB刻蚀基座进行加热,并在水平面或非水平面内进行旋转,使得待刻蚀样本发生多角度旋转,并在每个旋转角度上保持相同或不同的FIB刻蚀时间;在FIB刻蚀过程中或FIB刻蚀之后,对所述待刻蚀样本进行辅助刻蚀;去除所述掩膜层。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230901&DB=EPODOC&CC=CN&NR=116682727A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230901&DB=EPODOC&CC=CN&NR=116682727A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ZHAO SHAOFENG</creatorcontrib><title>Method for improving focused ion beam FIB etching morphology quality</title><description>The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB etching base is heated and rotates in a horizontal plane or a non-horizontal plane, so that the to-be-etched sample rotates at multiple angles, and the same or different FIB etching time is kept at each rotation angle; in the FIB etching process or after FIB etching, auxiliary etching is carried out on the sample to be etched; and removing the mask layer.
本发明实施例涉及一种提高聚焦离子束FIB刻蚀形貌质量的方法,包括:在待刻蚀样本上制作掩膜层;将待刻蚀样本固定在FIB刻蚀基座上;在FIB刻蚀过程中,对所述FIB刻蚀基座进行加热,并在水平面或非水平面内进行旋转,使得待刻蚀样本发生多角度旋转,并在每个旋转角度上保持相同或不同的FIB刻蚀时间;在FIB刻蚀过程中或FIB刻蚀之后,对所述待刻蚀样本进行辅助刻蚀;去除所述掩膜层。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDxTS3JyE9RSMsvUsjMLSjKL8vMSwfykkuLU1MUMvPzFJJSE3MV3DydFFJLkjNAkrn5RQUZ-Tn56ZUKhaWJOZkllTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DQzMzCyNzI3NGYGDUAl_Yyrg</recordid><startdate>20230901</startdate><enddate>20230901</enddate><creator>ZHAO SHAOFENG</creator><scope>EVB</scope></search><sort><creationdate>20230901</creationdate><title>Method for improving focused ion beam FIB etching morphology quality</title><author>ZHAO SHAOFENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116682727A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>ZHAO SHAOFENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ZHAO SHAOFENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for improving focused ion beam FIB etching morphology quality</title><date>2023-09-01</date><risdate>2023</risdate><abstract>The embodiment of the invention relates to a method for improving focused ion beam FIB etching morphology quality. The method comprises the following steps: manufacturing a mask layer on a sample to be etched; fixing a sample to be etched on the FIB etching base; in the FIB etching process, the FIB etching base is heated and rotates in a horizontal plane or a non-horizontal plane, so that the to-be-etched sample rotates at multiple angles, and the same or different FIB etching time is kept at each rotation angle; in the FIB etching process or after FIB etching, auxiliary etching is carried out on the sample to be etched; and removing the mask layer.
本发明实施例涉及一种提高聚焦离子束FIB刻蚀形貌质量的方法,包括:在待刻蚀样本上制作掩膜层;将待刻蚀样本固定在FIB刻蚀基座上;在FIB刻蚀过程中,对所述FIB刻蚀基座进行加热,并在水平面或非水平面内进行旋转,使得待刻蚀样本发生多角度旋转,并在每个旋转角度上保持相同或不同的FIB刻蚀时间;在FIB刻蚀过程中或FIB刻蚀之后,对所述待刻蚀样本进行辅助刻蚀;去除所述掩膜层。</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Method for improving focused ion beam FIB etching morphology quality |
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