Four-column high-precision polishing machine
The invention relates to polishing equipment, in particular to a four-column high-precision polishing machine which comprises a base and a machine frame arranged on the base, a lower large disc is installed on the base, four upper disc assemblies are arranged on the lower large disc and evenly distr...
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| creator | LEI LIMENG LAI RENYAN GUO SHENG'AN |
| description | The invention relates to polishing equipment, in particular to a four-column high-precision polishing machine which comprises a base and a machine frame arranged on the base, a lower large disc is installed on the base, four upper disc assemblies are arranged on the lower large disc and evenly distributed on the lower large disc through positioning assemblies, and the four upper disc assemblies are arranged on the lower large disc. A servo motor arranged in the base drives the lower large disc to rotate through a speed reducer, each upper disc assembly is driven by an air cylinder to move up and down, and when the upper disc assemblies descend to the lower large disc, the upper disc assemblies carrying to-be-polished pieces rotate on the rotating lower large disc so as to grind and polish the to-be-polished pieces. The four upper disc assemblies are adopted for grinding and polishing on the rotating lower large disc, four pieces to be polished can be machined at the same time, and the machining efficiency is |
| format | Patent |
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A servo motor arranged in the base drives the lower large disc to rotate through a speed reducer, each upper disc assembly is driven by an air cylinder to move up and down, and when the upper disc assemblies descend to the lower large disc, the upper disc assemblies carrying to-be-polished pieces rotate on the rotating lower large disc so as to grind and polish the to-be-polished pieces. The four upper disc assemblies are adopted for grinding and polishing on the rotating lower large disc, four pieces to be polished can be machined at the same time, and the machining efficiency is</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230901&DB=EPODOC&CC=CN&NR=116673857A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230901&DB=EPODOC&CC=CN&NR=116673857A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEI LIMENG</creatorcontrib><creatorcontrib>LAI RENYAN</creatorcontrib><creatorcontrib>GUO SHENG'AN</creatorcontrib><title>Four-column high-precision polishing machine</title><description>The invention relates to polishing equipment, in particular to a four-column high-precision polishing machine which comprises a base and a machine frame arranged on the base, a lower large disc is installed on the base, four upper disc assemblies are arranged on the lower large disc and evenly distributed on the lower large disc through positioning assemblies, and the four upper disc assemblies are arranged on the lower large disc. A servo motor arranged in the base drives the lower large disc to rotate through a speed reducer, each upper disc assembly is driven by an air cylinder to move up and down, and when the upper disc assemblies descend to the lower large disc, the upper disc assemblies carrying to-be-polished pieces rotate on the rotating lower large disc so as to grind and polish the to-be-polished pieces. The four upper disc assemblies are adopted for grinding and polishing on the rotating lower large disc, four pieces to be polished can be machined at the same time, and the machining efficiency is</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNBxyy8t0k3OzynNzVPIyEzP0C0oSk3OLM7Mz1MoyM_JLM7IzEtXyE1MBtKpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0NDMzNzYwtTc0ZgYNQCvUyod</recordid><startdate>20230901</startdate><enddate>20230901</enddate><creator>LEI LIMENG</creator><creator>LAI RENYAN</creator><creator>GUO SHENG'AN</creator><scope>EVB</scope></search><sort><creationdate>20230901</creationdate><title>Four-column high-precision polishing machine</title><author>LEI LIMENG ; LAI RENYAN ; GUO SHENG'AN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116673857A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>LEI LIMENG</creatorcontrib><creatorcontrib>LAI RENYAN</creatorcontrib><creatorcontrib>GUO SHENG'AN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEI LIMENG</au><au>LAI RENYAN</au><au>GUO SHENG'AN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Four-column high-precision polishing machine</title><date>2023-09-01</date><risdate>2023</risdate><abstract>The invention relates to polishing equipment, in particular to a four-column high-precision polishing machine which comprises a base and a machine frame arranged on the base, a lower large disc is installed on the base, four upper disc assemblies are arranged on the lower large disc and evenly distributed on the lower large disc through positioning assemblies, and the four upper disc assemblies are arranged on the lower large disc. A servo motor arranged in the base drives the lower large disc to rotate through a speed reducer, each upper disc assembly is driven by an air cylinder to move up and down, and when the upper disc assemblies descend to the lower large disc, the upper disc assemblies carrying to-be-polished pieces rotate on the rotating lower large disc so as to grind and polish the to-be-polished pieces. The four upper disc assemblies are adopted for grinding and polishing on the rotating lower large disc, four pieces to be polished can be machined at the same time, and the machining efficiency is</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN116673857A |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Four-column high-precision polishing machine |
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