High-voltage half-bridge driving chip and packaging structure thereof

The invention belongs to the technical field of integrated circuits, and particularly relates to a high-voltage half-bridge driving chip and a packaging structure. The circuit is characterized by comprising a high-voltage side driving chip, a low-voltage side driving chip, an MOS tube Q1 and an MOS...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MA PEI, ZHANG FENG, JIA HUAIBIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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