Composite quantum adhesive film, manufacturing method thereof and LED packaging structure
According to the composite quantum glue film, the manufacturing method thereof and the LED packaging structure provided by the invention, the LED packaging structure adopting the composite quantum glue layer can realize light emission with a relatively wide color gamut, and for a white light source,...
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creator | LUO XUEFANG |
description | According to the composite quantum glue film, the manufacturing method thereof and the LED packaging structure provided by the invention, the LED packaging structure adopting the composite quantum glue layer can realize light emission with a relatively wide color gamut, and for a white light source, light rays can be more uniform, and stray light of yellow and green light does not exist. Particularly, the thickness of the planar substrate is smaller than the height of the LED chip, and the total thickness of the first fluorescent adhesive film is larger than the height of the LED chip, so that the light emitting efficiency can be ensured, the light mixing effect can be improved, and the long service life can be ensured under the condition that the total packaging thickness is small. The thickness of the base body can enable the light on the side face not to be emitted in the form of original blue light of the LED, and the light can be fully mixed through scattering of the fluorescent powder of the base body. |
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Particularly, the thickness of the planar substrate is smaller than the height of the LED chip, and the total thickness of the first fluorescent adhesive film is larger than the height of the LED chip, so that the light emitting efficiency can be ensured, the light mixing effect can be improved, and the long service life can be ensured under the condition that the total packaging thickness is small. 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Particularly, the thickness of the planar substrate is smaller than the height of the LED chip, and the total thickness of the first fluorescent adhesive film is larger than the height of the LED chip, so that the light emitting efficiency can be ensured, the light mixing effect can be improved, and the long service life can be ensured under the condition that the total packaging thickness is small. The thickness of the base body can enable the light on the side face not to be emitted in the form of original blue light of the LED, and the light can be fully mixed through scattering of the fluorescent powder of the base body.</abstract><oa>free_for_read</oa></addata></record> |
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language | chi ; eng |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Composite quantum adhesive film, manufacturing method thereof and LED packaging structure |
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