Preparation method of multilayer circuit board

The invention discloses a preparation method of a multi-layer circuit board, and belongs to the technical field of circuit boards, in the preparation process, a composite film is used, dried polyether-ether-ketone, hydroxyl-terminated modified polyphenyl ether, a pretreated filler, modified N-benzyl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM SAE-YONG, SHU SHIQUAN, LIU LONGTAN, WANG TIANWEN, RAO ZHIQIANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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