Bonding device and bonding system

The invention provides a bonding apparatus and a bonding system for suppressing strain of a bonded substrate. A joining device according to an embodiment includes a first holding portion, a second holding portion, and a striker. The first holding portion sucks and holds the first substrate from abov...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUGAKAWA KENJI, OHMORI YOSUKE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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