Bonding device and bonding system
The invention provides a bonding apparatus and a bonding system for suppressing strain of a bonded substrate. A joining device according to an embodiment includes a first holding portion, a second holding portion, and a striker. The first holding portion sucks and holds the first substrate from abov...
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| creator | SUGAKAWA KENJI OHMORI YOSUKE |
| description | The invention provides a bonding apparatus and a bonding system for suppressing strain of a bonded substrate. A joining device according to an embodiment includes a first holding portion, a second holding portion, and a striker. The first holding portion sucks and holds the first substrate from above. The second holding portion is disposed below the first holding portion and sucks and holds the second substrate from below. The striker presses the central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. In addition, the first holding portion sucks and holds a partial region of the outer peripheral portion of the first substrate, and sucks and holds a region intersecting with a direction in which the enlargement of a bonding region between the first substrate and the second substrate is fastest, among the directions from the central portion of the first substrate toward the outer peripheral portion.
本发明提供一种抑制接合后的基板的应变的接合装置和接合系统 |
| format | Patent |
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本发明提供一种抑制接合后的基板的应变的接合装置和接合系统</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB0ys9LycxLV0hJLctMTlVIzEtRSIIKFVcWl6Tm8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeGc_Q0MzMxMzI3MzR2Ni1AAAbIclgA</recordid><startdate>20230825</startdate><enddate>20230825</enddate><creator>SUGAKAWA KENJI</creator><creator>OHMORI YOSUKE</creator><scope>EVB</scope></search><sort><creationdate>20230825</creationdate><title>Bonding device and bonding system</title><author>SUGAKAWA KENJI ; OHMORI YOSUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116646276A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SUGAKAWA KENJI</creatorcontrib><creatorcontrib>OHMORI YOSUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUGAKAWA KENJI</au><au>OHMORI YOSUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Bonding device and bonding system</title><date>2023-08-25</date><risdate>2023</risdate><abstract>The invention provides a bonding apparatus and a bonding system for suppressing strain of a bonded substrate. A joining device according to an embodiment includes a first holding portion, a second holding portion, and a striker. The first holding portion sucks and holds the first substrate from above. The second holding portion is disposed below the first holding portion and sucks and holds the second substrate from below. The striker presses the central portion of the first substrate from above to bring the central portion of the first substrate into contact with the second substrate. In addition, the first holding portion sucks and holds a partial region of the outer peripheral portion of the first substrate, and sucks and holds a region intersecting with a direction in which the enlargement of a bonding region between the first substrate and the second substrate is fastest, among the directions from the central portion of the first substrate toward the outer peripheral portion.
本发明提供一种抑制接合后的基板的应变的接合装置和接合系统</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Bonding device and bonding system |
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