Method for characterizing internal stress of epoxy packaging material

The invention discloses a characterization method for internal stress of an epoxy packaging material. Comprising the following steps: 1) placing a strain gauge in a packaging mold; 2) placing an epoxy molding compound in the packaging mold, leading a lead wire of the strain gauge out of the packaging mold, and connecting the lead wire with a stress testing device through a connecting wire; (3) curing and demolding; and 4) carrying out stress monitoring on the demolded packaged sample, and collecting information through the strain testing device. According to the in-situ characterization method, in-situ real-time internal stress characterization can be conducted on the resin composite material from the injection molding stage to the post-curing ending stage, internal stress real-time monitoring is achieved, the change of the internal stress of the resin composite material is visually recognized, important data support is provided for optimizing the technological process and the formula of the resin composite m