Vapor deposition device
The invention discloses an evaporation device. The evaporation device comprises a plurality of point source evaporation sources; the evaporation source comprises a first evaporation source and a second evaporation source, an outlet of the first evaporation source releases a main material, and an out...
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| creator | FAN LIUJING DONG QINGQING |
| description | The invention discloses an evaporation device. The evaporation device comprises a plurality of point source evaporation sources; the evaporation source comprises a first evaporation source and a second evaporation source, an outlet of the first evaporation source releases a main material, and an outlet of the second evaporation source releases a doped material; the evaporation sources are arranged in the first direction to form an evaporation source row, the evaporation sources are arranged in the second direction to form an evaporation source column, and the first direction intersects with the second direction; in the second direction, at least the first evaporation source is adjacent to the second evaporation source in the two adjacent evaporation source rows, and in the first direction, at least the first evaporation source is adjacent to the second evaporation source in the two adjacent evaporation source columns. According to the invention, the host material and the guest material are uniformly mixed, an |
| format | Patent |
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The evaporation device comprises a plurality of point source evaporation sources; the evaporation source comprises a first evaporation source and a second evaporation source, an outlet of the first evaporation source releases a main material, and an outlet of the second evaporation source releases a doped material; the evaporation sources are arranged in the first direction to form an evaporation source row, the evaporation sources are arranged in the second direction to form an evaporation source column, and the first direction intersects with the second direction; in the second direction, at least the first evaporation source is adjacent to the second evaporation source in the two adjacent evaporation source rows, and in the first direction, at least the first evaporation source is adjacent to the second evaporation source in the two adjacent evaporation source columns. According to the invention, the host material and the guest material are uniformly mixed, an</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230825&DB=EPODOC&CC=CN&NR=116641027A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230825&DB=EPODOC&CC=CN&NR=116641027A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FAN LIUJING</creatorcontrib><creatorcontrib>DONG QINGQING</creatorcontrib><title>Vapor deposition device</title><description>The invention discloses an evaporation device. 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According to the invention, the host material and the guest material are uniformly mixed, an</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAPSyzIL1JISS3IL84syczPAzLLMpNTeRhY0xJzilN5oTQ3g6Kba4izhy5QYXxqcUFicmpeakm8s5-hoZmZiaGBkbmjMTFqANBuIew</recordid><startdate>20230825</startdate><enddate>20230825</enddate><creator>FAN LIUJING</creator><creator>DONG QINGQING</creator><scope>EVB</scope></search><sort><creationdate>20230825</creationdate><title>Vapor deposition device</title><author>FAN LIUJING ; DONG QINGQING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN116641027A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>FAN LIUJING</creatorcontrib><creatorcontrib>DONG QINGQING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FAN LIUJING</au><au>DONG QINGQING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Vapor deposition device</title><date>2023-08-25</date><risdate>2023</risdate><abstract>The invention discloses an evaporation device. The evaporation device comprises a plurality of point source evaporation sources; the evaporation source comprises a first evaporation source and a second evaporation source, an outlet of the first evaporation source releases a main material, and an outlet of the second evaporation source releases a doped material; the evaporation sources are arranged in the first direction to form an evaporation source row, the evaporation sources are arranged in the second direction to form an evaporation source column, and the first direction intersects with the second direction; in the second direction, at least the first evaporation source is adjacent to the second evaporation source in the two adjacent evaporation source rows, and in the first direction, at least the first evaporation source is adjacent to the second evaporation source in the two adjacent evaporation source columns. According to the invention, the host material and the guest material are uniformly mixed, an</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | Vapor deposition device |
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