LED packaging structure and LED packaging method

LED packaging structure and LED packaging method

The invention relates to the technical field of light-emitting device manufacturing, and provides an LED packaging structure and an LED packaging method.The LED packaging structure comprises a substrate, a light-emitting diode (LED) light source, a light-emitting diode (LED) light source, a light-em...

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Hauptverfasser: CHENG PENG, KE YOUPU
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator CHENG PENG
KE YOUPU
description The invention relates to the technical field of light-emitting device manufacturing, and provides an LED packaging structure and an LED packaging method.The LED packaging structure comprises a substrate, a light-emitting diode (LED) light source, a light-emitting diode (LED) light source, a light-emitting diode (LED) light source and a light-emitting diode (LED) light source, the LED chip is fixed on the front surface of the substrate; the support is annular and is provided with an inner side wall, a top and a bottom, the bottom of the support is seated on the front face of the substrate, the support surrounds the periphery of the LED chip, at least one part, located above the LED chip, of the inner side wall of the support is provided with a mounting groove penetrating through the top of the support, and the mounting groove is provided with a groove bottom face and a groove side wall; the positioning block is arranged in the mounting groove; the bottom surface of the light-transmitting part abuts against the
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title LED packaging structure and LED packaging method
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