POWER COATING STRUCTURE WITH WIRE BONDES AND METHOD OF MANUFACTURING THE SAME

The invention relates to a power cladding structure with a wire bond and a method of manufacturing the same. Specifically, a power cladding (POL) structure includes: a power device having at least one upper contact pad disposed on an upper surface of the power device; and a POL interconnect layer having a dielectric layer coupled to an upper surface of the power device, and a metallization layer having a metal interconnect extending through a via and electrically coupled to at least one upper contact pad of the power device, the via being formed through the dielectric layer. The POL structure also includes at least one copper wire bond directly coupled to the metallization layer. 本发明涉及具有引线接合件的功率覆层结构和制造其的方法。具体而言，功率覆层(POL)结构包括：功率器件，其具有布置在功率器件的上表面上的至少一个上接触焊盘；和POL互连层，其具有联接至功率器件的上表面的电介质层、和金属化层，金属化层具有金属互连件，该金属互连件延伸穿过通孔并且电联接至功率器件的至少一个上接触焊盘，该通孔穿过电介质层而形成。POL结构还包括直接联接至金属化层的至少一个铜引线接合件。