SEMICONDUCTOR PACKAGE DEVICE
The invention relates to a semiconductor packaging device. The semiconductor package device includes: a first chip; the dielectric material is arranged on the side surface of the first chip; the conductive structure comprises a first part and a second part, the first part and the second part are ele...
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| creator | HONG LIJIE GUO HONGJUN |
| description | The invention relates to a semiconductor packaging device. The semiconductor package device includes: a first chip; the dielectric material is arranged on the side surface of the first chip; the conductive structure comprises a first part and a second part, the first part and the second part are electrically connected, the first part is located above the upper surface of the first chip, the second part is located on the side face of the first chip and is spaced from the first chip through the dielectric material, and the conductive structure is used for supplying power to the first chip through the upper surface of the first chip. According to the semiconductor packaging device, the electric connection between the substrate and the chip is realized by utilizing the conductive structure with the first part and the second part, and a connecting wire is not needed for electric connection, so that the longitudinal size of the semiconductor packaging device is prevented from being additionally increased by a wire |
| format | Patent |
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The semiconductor package device includes: a first chip; the dielectric material is arranged on the side surface of the first chip; the conductive structure comprises a first part and a second part, the first part and the second part are electrically connected, the first part is located above the upper surface of the first chip, the second part is located on the side face of the first chip and is spaced from the first chip through the dielectric material, and the conductive structure is used for supplying power to the first chip through the upper surface of the first chip. According to the semiconductor packaging device, the electric connection between the substrate and the chip is realized by utilizing the conductive structure with the first part and the second part, and a connecting wire is not needed for electric connection, so that the longitudinal size of the semiconductor packaging device is prevented from being additionally increased by a wire</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230801&DB=EPODOC&CC=CN&NR=116525597A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230801&DB=EPODOC&CC=CN&NR=116525597A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HONG LIJIE</creatorcontrib><creatorcontrib>GUO HONGJUN</creatorcontrib><title>SEMICONDUCTOR PACKAGE DEVICE</title><description>The invention relates to a semiconductor packaging device. 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The semiconductor package device includes: a first chip; the dielectric material is arranged on the side surface of the first chip; the conductive structure comprises a first part and a second part, the first part and the second part are electrically connected, the first part is located above the upper surface of the first chip, the second part is located on the side face of the first chip and is spaced from the first chip through the dielectric material, and the conductive structure is used for supplying power to the first chip through the upper surface of the first chip. According to the semiconductor packaging device, the electric connection between the substrate and the chip is realized by utilizing the conductive structure with the first part and the second part, and a connecting wire is not needed for electric connection, so that the longitudinal size of the semiconductor packaging device is prevented from being additionally increased by a wire</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR PACKAGE DEVICE |
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